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Wafer loading finger of pre-vacuum locking chamber

A pre-vacuum lock, wafer technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of contact surface blackening, difficult to clean, particle hidden dangers, etc., to increase windows, facilitate cleaning or replacement, The effect of improving process stability

Inactive Publication Date: 2020-02-28
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. Wafer and ceramics are in direct contact, and slight friction during transmission will cause particles, resulting in surface defects of wafer products
[0010] 2. The friction between the ceramic surface and the wafer will make the contact surface black, which has hidden dangers of particle and is difficult to clean

Method used

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  • Wafer loading finger of pre-vacuum locking chamber
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  • Wafer loading finger of pre-vacuum locking chamber

Examples

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Embodiment Construction

[0044] Such as figure 2 As shown, it is a top view of the wafer loading finger of the pre-vacuum lock chamber according to the embodiment of the present invention; image 3 is along figure 2 Sectional view of line AA in ; Figure 4 is along figure 2 The sectional view of the BB line in; Figure 5 yes Figure 4 The schematic diagram when the corresponding wafer point contact part 3 and the through hole 2 are separated; Figure 6It is an enlarged view of the wafer point contact part 3 of the embodiment of the present invention; the main structure 1 of the wafer loading finger of the pre-vacuum lock chamber of the embodiment of the present invention is composed of ceramic material.

[0045] Between the front end and the root of the main structure 1 is a wafer carrying area, and a wafer point contact portion 3 is provided on the front end of the main structure 1 .

[0046] The top surface of the wafer point contact part 3 protrudes above the top surface of the main body s...

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Abstract

The invention discloses a wafer loading finger of a pre-vacuum locking chamber. The wafer loading finger is characterized in that a main body structure is made of a ceramic material, a front end partof the main body structure is provided with a wafer point contact part, a top surface of the wafer point contact part protrudes out of a top surface of the main body structure, so the wafer is in point contact with the wafer loading finger, and the contact area of the wafer is reduced. The wafer point contact part is made of a soft material of which the hardness is less than that of the ceramic material, so the vibration of the wafer is reduced. The wafer point contact part is detachably arranged on the main body structure, so the wafer point contact part can be conveniently cleaned and replaced. The wafer loading finger is advantaged in that the number of particle defects caused by friction between fingers and a wafer can be reduced or eliminated, process stability and the process windowcan be improved, a maintenance period of the cavity can be prolonged, and the normal operation time of equipment can be prolonged.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing equipment, in particular to a wafer loading finger in a pre-vacuum lock chamber. Background technique [0002] The AMEC DRIE machine provided by AMEC Semiconductor Equipment (Shanghai) Co., Ltd. (AMEC) is a plasma etching machine. A single device of the AMEC DRIE machine has 4 reaction chambers and 2 pre-vacuum lock chambers ( loadlockchamber), this design ensures higher productivity and is an important etching machine in wafer (wafer) processing. [0003] A pre-vacuum lock chamber is used to transfer wafers from the atmosphere and then seal and evacuate them. Afterwards, the wafer is transferred to the reaction chamber for process steps; otherwise, after the wafer completes the process steps in the reaction chamber, it needs to be put back into the pre-vacuum lock chamber, and then the pre-vacuum lock chamber is broken to vacuum the wafer. The circles are transported back into...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67011H01L21/68714H01L21/68728
Inventor 董海平邓必文张钱
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD