A multi-lead ceramic component packaging shell and its processing method
A multi-lead, encapsulation technology, applied in electrical components, semiconductor devices, electric solid devices, etc., can solve the problems of fragile multi-lead glass components and insufficient air tightness of ceramic components, and ensure strength and stability. , Improve the air tightness of the product and the effect of improving the service life
Active Publication Date: 2021-10-19
HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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Problems solved by technology
[0004] In order to solve the problem of the traditional multi-lead glass components being fragile and the airtightness of ceramic components not enough in the prior art, a multi-lead ceramic component packaging shell is needed to ensure high strength and good stability while having high airtightness sex
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[0029] A preferred embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0030] Such as figure 1 As shown, a multi-lead ceramic component package housing includes a ceramic substrate 1, nailhead leads 2, and a transition ring 3, wherein:
[0031] A ceramic substrate 1, a number of blind holes 11 distributed in an array for positioning are symmetrically arranged on the two opposite end surfaces of the ceramic substrate, and the inner wall of each blind hole is provided with a metallization layer 12, and the two opposite blind holes The inner metallization layers are connected to each other; the ceramic substrate described in this preferred embodiment is an alumina ceramic substrate, and the alumina substrate is the most commonly used substrate material in the electronics industry because it is mechanically, thermally and electrically superior to most other oxide ceramic substrates. Material ceramics have high str...
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Abstract
The invention provides a multi-lead ceramic packaging shell and a processing method thereof, comprising a ceramic substrate, a nailhead lead, and a transition ring, and a plurality of array-distributed blind holes for positioning are symmetrically arranged on two opposite end surfaces of the ceramic substrate , the inner wall of each blind hole is provided with a metallization layer, and the metallization layers in two opposite blind holes are connected to each other; the nail head part of the nail head lead is fixedly connected to the inner wall of the blind hole by brazing The transition ring is fixedly connected to any end surface of the ceramic substrate provided with a blind hole by brazing, the nail head lead passes through the transition ring and the height of the transition ring does not exceed the nail head lead extending out of the blind hole The portion of the transition ring in contact with the ceramic substrate is pre-set with a transition ring metallization layer. In the present invention, blind holes are opened on the two opposite end faces of the ceramic substrate, and two sets of nail-head leads are welded in the blind holes through a brazing process, so as to ensure the strength and stability while greatly improving the airtightness of the product and the service life. also greatly improved.
Description
technical field [0001] The invention relates to the technical field of packaging of electronic products and hybrid electronic products, in particular to a packaging shell of a multi-lead ceramic component and a processing method thereof. Background technique [0002] Multi-lead assemblies are generally used for devices that need to transmit multiple electrical signals simultaneously and independently. They are often used in some switch modules, which require high strength and stability, and their airtightness directly affects the service life of the product. [0003] In the prior art, the components used to transmit signals in the packaging shell usually adopt two types: multi-lead glass components and multi-lead ceramic components. Cracks are prone to occur after stress, leading to failure of the airtightness of the component; while multi-lead ceramic components include leads, transition rings, and ceramic substrates. The ceramic substrate has the characteristics of high st...
Claims
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IPC IPC(8): H01L23/055H01L21/48
CPCH01L21/4817H01L23/055
Inventor 金鑫张庆胡一曲
Owner HEFEI SHENGDA ELECTRONIC TECH IND CO LTD