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LED chip support stamping device

A technology for LED chips and stamping equipment, applied in safety equipment, metal processing equipment, forming tools, etc., can solve the problems of high operating temperature of stamping cylinders and injuries to operators, and achieve the goal of avoiding injuries, improving safety, and reducing operating temperature. Effect

Inactive Publication Date: 2020-03-17
BOLUO COUNTY ZHENGRUN PHOTOELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a stamping equipment for LED chip holders, which has the advantages of being able to shield the sputtered waste and reduce the operating temperature of the stamping cylinder, and solves the problem that the sputtered waste in the prior art is likely to cause injury to the operator and ram cylinders running too hot

Method used

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-4 , a LED chip support stamping equipment, including a base 1, an L-shaped mounting frame 2 is fixedly connected to the side wall on the upper side of the base 1, a stamping cylinder 3 is fixedly connected to the side wall on the upper side of the L-shaped mounting frame 2, and a stamping cylinder 3 The output end is fixedly connected with a stamping plate 4, the upper side of the base 1 is connected with a stamping die 5, the side wall on the right side of the base 1 is connected with a shielding mechanism 6, a...

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Abstract

The invention relates to the technical field of LED chip support machining, and discloses an LED chip support stamping device. The LED chip support stamping device comprises a base, wherein an L-shaped mounting frame is fixedly connected to the side wall of the upper side of the base; a stamping air cylinder is fixedly connected to the side wall of the upper side of the L-shaped mounting frame; the output end of the stamping air cylinder is fixedly connected with a stamping plate; a stamping die is connected to the upper side of the base; a shielding mechanism is connected to the side wall ofthe right side of the base; and an auxiliary heat dissipation mechanism is connected to the side wall of the upper side of the L-shaped mounting frame. According to the LED chip support stamping device, the damage of waste materials to operators can be avoided, the safety of production and machining is effectively improved, the operation temperature of the stamping air cylinder can be reduced, andthe service life of the stamping air cylinder is effectively prolonged.

Description

technical field [0001] The invention relates to the technical field of LED chip support processing, in particular to stamping equipment for LED chip support. Background technique [0002] An LED chip is a solid-state semiconductor device that converts electricity directly into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. The LED chip holder is mass-produced and processed through the stamping process. [0003] When the existing LED chip holder stamping equipment is in use, the stamping waste is easy to splash around, and the sputtered waste flies faster, and when it collides with the human body, it is easy to cause injury to the operator and cause production accidents, and the existing stamping equipment The stamping cylinder needs to run uninterruptedly for a long time, and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D37/16B21D55/00
CPCB21D37/16B21D55/00
Inventor 冯桂然冯建新
Owner BOLUO COUNTY ZHENGRUN PHOTOELECTRIC