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Electronic component and manufacturing method thereof

A technology of electronic components and manufacturing methods, which is applied in the direction of resistance manufacturing, electrical components, resistor parts, etc., and can solve the problems of increasing manufacturing costs of electronic components

Active Publication Date: 2020-03-24
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for conventional thin electronic components, since expensive equipment is required, the manufacturing cost of electronic components increases

Method used

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  • Electronic component and manufacturing method thereof
  • Electronic component and manufacturing method thereof
  • Electronic component and manufacturing method thereof

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Embodiment Construction

[0016] Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0017] In addition, a thin film chip resistor will be described below as an example of an electronic component. However, electronic components according to the present disclosure are not limited to resistors, but may include various types of electronic components such as chip inductors, chip capacitors, and the like.

[0018] Figure 1A to Figure 1G is a diagram illustrating a method of manufacturing an electronic component according to an exemplary embodiment in the present disclosure.

[0019] First, the substrate 100 can be prepared ( Figure 1A ). In the drawings, T represents the thickness direction, L represents the length direction, and W represents the width direction. Hereinafter, this will apply in the same way to all figures.

[0020] Then, the resistive film 110 may be formed on the substrate 100 ( Figure 1B ). Fo...

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PUM

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Abstract

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2018-0110895 filed with the Korean Intellectual Property Office on September 17, 2018, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a thin film electronic component and a manufacturing method thereof. Background technique [0003] There is a continuing need for miniaturization of electronic devices and reduction of their manufacturing costs. Therefore, miniaturization, thinning and reduction of manufacturing costs are constantly required for various electronic components used in electronic devices. [0004] In order to miniaturize and slim the electronic components, thin film electronic components having thinly formed electrodes and various patterns included in the electronic components have been widely developed. However, for conventional thin electronic components, since expensive equipment ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C1/032H01C1/14H01C1/16H01C7/00H01C17/02H01C17/12H01C17/28
CPCH01C7/006H01C1/14H01C1/16H01C1/032H01C17/12H01C17/288H01C17/02H01C3/12H01C17/281H01C1/142H01C1/012H01C17/065H01C17/28H01C7/003H01C17/006
Inventor 李锺泌刘斗镐金亨坤金正逸崔玹准卢亨锡
Owner SAMSUNG ELECTRO MECHANICS CO LTD