Method for fixing LED chip on back plate

A LED chip and backplane technology, applied in the field of LED chip fixing, to achieve the effect of simple process and easy industrial mass production
CN110911285AActive Publication Date: 2020-03-24HCP TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HCP TECH CO LTD
Publication Date
2020-03-24

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Abstract

The invention discloses a method for fixing an LED chip on a back plate, which comprises a process of fixing the LED chip on a glass plate, transferring the LED chip to the back plate and fixing the LED chip on the back plate, and the method is simple in process, so that not only is the production efficiency improved, but also the yield in the production process is improved.
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Description

technical field

[0001] The invention relates to LED chip fixing technology, more specifically, the invention relates to a method for fixing LED chips to a backboard. Background technique

[0002] In the first half of 2018, major events in the LED industry continued one after another, with mixed results. Lighting giants changed their names and upgraded one after another, domestic companies were busy expanding, and joint giants laid out global markets. Concern and joy These all let us see that China's LED industry has opened an era of internationalization. At the beginning of February this year, Samsung signed a $16.83 million advance payment "Advance Payment Agreement" with Sanan Optoelectronics, agreeing to purchase Sanan's LED chips for display products, and will maintain continuous strategic cooperation with Micro LED in the process. Sanan Optoelectronics can make a breakthrough in the mass production of Micro LED, which will establish Sanan Optoelectronics' leading pos...

Claims

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