Improved microwave variable-frequency power supply assembly and heat dissipation structure

A technology of microwave frequency conversion and frequency conversion power supply, applied in transformer/inductor coil/winding/connection, electrical components, electric solid device and other directions, can solve the problem of low ventilation efficiency, small overall heat dissipation, microwave frequency conversion power supply ventilation and cooling air duct unreasonable issues

Pending Publication Date: 2020-03-24
SONG RES ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an improvement in order to solve the problem of unreasonable structure of the components constituting the microwave variable frequency power supply and the unreasonable structure of the internal ventilation and heat dissipation ducts, low ventilation efficiency, small overall heat dissipation, and poor heat dissipation effect in the existing microwave variable frequency power supply. The advanced microwave variable frequency power supply components have outstanding substantive features and significant progress, such as simple and reasonable component structure, reasonable ventilation and heat dissipation air duct setting, high ventilation efficiency, large overall heat dissipation and good heat dissipation effect.
[0006] The second object of the present invention is to provide an improved cooling structure for microwave variable frequency power supplies to solve the problems of unreasonable ventilation and heat dissipation air ducts, low ventilation efficiency, small overall heat dissipation and poor heat dissipation effect in existing microwave variable frequency power supplies. It has outstanding substantive features and significant progress such as reasonable ventilation and heat dissipation air ducts, high ventilation efficiency, large overall heat dissipation and good heat dissipation effect.

Method used

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  • Improved microwave variable-frequency power supply assembly and heat dissipation structure
  • Improved microwave variable-frequency power supply assembly and heat dissipation structure
  • Improved microwave variable-frequency power supply assembly and heat dissipation structure

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specific Embodiment 1

[0055] refer to Figure 1 to Figure 11The improved microwave variable frequency power supply assembly involved in this embodiment 1 includes a housing and a microwave variable frequency power supply board 102 disposed in the inner cavity of the housing, the housing includes an upper cover 2 and a bottom shell 3, and the upper cover 2 and the bottom shell 3 are connected by snap-fitting Integral, forming a sealed air duct in the inner cavity; the variable frequency power supply board 102 includes a printed board 103, a radiator 104, a transformer 105, a first semiconductor component 106, a second semiconductor component 107, a first high voltage diode 108, The second high-voltage diode 109, the first high-voltage capacitor 110 and the second high-voltage capacitor 111; the first semiconductor component 106 and the second semiconductor component 107 are installed on the mounting surface of the radiator 104, and the first high-voltage diode 108, the second high-voltage capacitor ...

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Abstract

The invention relates to an improved microwave variable-frequency power supply assembly and a heat dissipation structure. The power supply assembly is characterized by comprising a shell and a microwave variable-frequency power supply board arranged in an inner cavity of the shell, and a sealed air duct is formed in the inner cavity of the shell. The variable-frequency power supply board comprisesa printed board, a radiator, a transformer, a semiconductor component, a high-voltage diode and a high-voltage capacitor. The semiconductor component is installed on the installation surface of the radiator. The high-voltage diode and the high-voltage capacitor are connected with the voltage output end of the transformer. The radiator is composed of a first radiating body, a second radiating body, a plurality of first radiating teeth and a plurality of second radiating teeth. The first heat dissipation body, the plurality of first heat dissipation teeth and the upper cover form a first air duct, and the second heat dissipation body, the plurality of second heat dissipation teeth and the upper cover form a second air duct. The semiconductor component, the transformer and the printing plateform a third air duct, a primary winding of the transformer, the first high-voltage diode and the bottom shell form a fourth air duct, and a secondary winding of the transformer, the high-voltage diode and the bottom shell 2 form a fifth air duct. The power supply assembly is characterized by ventilation and reasonable heat dissipation air duct arrangement, and the ventilation efficiency is high.

Description

technical field [0001] The invention relates to an improved microwave variable frequency power supply assembly. The utility model belongs to the technical field of industrial microwave frequency conversion power supply. Background technique [0002] The drive power of the magnetron of traditional microwave equipment usually adopts the circuit structure of power frequency high voltage transformer, which limits the versatility of the microwave equipment due to its high energy consumption, large size, bulkiness and non-adjustable power. In recent years, microwave frequency conversion power supply is gradually replacing the traditional power frequency high voltage transformer circuit structure due to the advantages of energy saving, good reliability, wide voltage adaptability, and continuous power adjustment. [0003] Since the high-frequency transformer and semiconductor power components of the microwave variable frequency power supply will generate a lot of heat during work, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00H05K7/20H01L23/367H01L23/467H01F27/08H01F27/30
CPCH01F27/085H01F27/306H01L23/367H01L23/467H02M1/00H05K7/20409H05K7/209H05K7/20909
Inventor 卢高锋韩镕蔚
Owner SONG RES ELECTRONICS TECH
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