Crystal oscillator packaging equipment

Abstract

The invention discloses and provides full-automatic crystal oscillator packaging equipment. The crystal oscillator packaging equipment is characterized by saving cost and being high in efficiency andgood in production effect. The crystal oscillator packaging equipment comprises an outer machine body, wherein a base (1) is arranged in the outer machine body; a to-be-packaged product feeding device, a shell assembly positioning spot welding device, a long edge sealing welding device, a vacuumizing welding short edge device and a discharging device are sequentially arranged on the base (1); andone sides of the to-be-packaged product feeding device and the shell assembly positioning spot welding device are each provided with a pushing device correspondingly. The crystal oscillator packagingequipment is applicable to the field of packaging of crystal oscillators.

Description

technical field [0001] The invention relates to a packaging device for a crystal oscillator. Background technique [0002] At present, the existing crystal oscillators are packaged in the capacitive storage stamping discharge welding mode. The sealing and welding process is that the product to be packaged is manually put on the shell, the product is placed in the feeding bin, nitrogen is injected, the product is sent into the packaging mold, and Stamping discharge welding is completed. [0003] The disadvantages of the existing stamping discharge packaging are: the operation mode requires manual casing, the production cost is high and the efficiency is low; the stamping discharge packaging is due to stress changes in the base of the product during the stamping process, and the frequency of the crystal The tolerance changes greatly, so there are only 10% good products in the production of ≤ppm small tolerance products, and the good product rate of the packaged products is lo...

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Problems solved by technology

[0003] The disadvantages of the existing stamping discharge packaging are: the operation mode requires manual casing, the production cost is high and the efficiency is low; the stamping discharge packaging is due to stress changes in the base of the product during the stamping process, and the frequency of the crystal The tolerance changes greatly, so there are only 10% good products in the production of ≤ppm small tolerance products, and the good product rate of the packaged products is low; nitrogen-filled packaging cannot reduce the product impedance value, and it is impossible to produce products with small impedance

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