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Cyanide-free alkaline copper electroplating liquid and using method thereof

A technology of electroplating solution and alkali copper, which is applied in the field of cyanide-free alkali copper electroplating solution, can solve the problems of replacing copper and not solving the problems of cyanide-free alkaline copper plating solution, and achieves simple operation, improved electrodeposition rate, and easy-to-obtain reagents Effect

Active Publication Date: 2020-03-27
GUANGZHOU SANFU NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But this invention does not solve the problem that the cyanide-free alkaline copper plating solution is easy to replace copper

Method used

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  • Cyanide-free alkaline copper electroplating liquid and using method thereof
  • Cyanide-free alkaline copper electroplating liquid and using method thereof
  • Cyanide-free alkaline copper electroplating liquid and using method thereof

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Effect test

Embodiment 1-6

[0036] Embodiment 1-6, cyanide-free electroplating lye and using method thereof

[0037] The formula of cyanide-free electroplating alkaline solution among the embodiment 1-6 is shown in the table below.

[0038] Table 1

[0039]

Embodiment 1

[0040] The using method of cyanide-free electroplating lye among the embodiment 1 is as follows:

[0041] S1. Configuration of electroplating solution: take citrate, auxiliary complexing agent, conductive salt, brightener and add tap water accounting for about 2 / 3 of the total to fully dissolve, add pH regulator and divalent copper ion compound and stir to fully dissolve, then set capacity, the electroplating solution is obtained;

[0042] S2. Pretreatment of plated parts: process the plated parts through the steps of water washing, chemical degreasing, hot water washing, pickling, and tap water cleaning;

[0043] S3. Electroplating: take the copper sheet as the anode and the piece to be plated as the cathode, add the electroplating solution at a current density of 1.5A / dm 2 , temperature 35 ° C, electroplating for 10 minutes, that is, copper-plated parts.

Embodiment 2

[0044] The usage method of the cyanide-free electroplating alkali solution in embodiment 2 refers to embodiment 1, and the difference is that the electroplating parts used are aluminum alloys.

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Abstract

The invention belongs to the technical field of electroplating, and particularly relates to a cyanide-free alkaline copper electroplating liquid and a using method thereof. The cyanide-free alkaline copper electroplating liquid comprises 5-8 g / L of bivalent copper ions, 75-85 g / L of citrate, 15-25 g / L of an auxiliary complexing agent, 25-35 g / L of conducting salt, 8-15 g / L of a pH regulator and 0.5-1.5 g / L of a brightener, wherein the auxiliary complexing agent is a mixture of an organic amine compound and a polyhydroxy carboxylic acid compound. By optimizing the complexing agent, no copper powder is separated out in the electroplating process of the obtained copper electroplating liquid, the electro-deposition speed of electroplated copper is increased, an obtained plating layer is fine and uniform, the binding force of the plating layer is good, various castings such as steel, brass, aluminum alloy and zinc die castings can be electroplated, and the industrial production is facilitated.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a cyanide-free alkali copper electroplating solution and a using method thereof. Background technique [0002] Copper is a metal with good ductility, high thermal and electrical conductivity, good stability, and purple-red luster. It is often evenly plated on the surface of various substances by electroplating technology, and can be used as a protective decorative coating and a pre-plating intermediate layer. , circuit coating, etc., play the role of decoration, conduction, heat conduction, pre-plating and so on. Copper plating is divided into two categories: cyanide copper plating and cyanide-free copper plating. The cyanide copper plating solution has good stability, good copper plating coverage, fast deposition speed, good dispersion, low coating porosity, good anode solubility, no copper powder, good coating quality, but cyanide is highly toxic During the...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 田志斌邓正平詹益腾
Owner GUANGZHOU SANFU NEW MATERIALS TECH