Flexible copper-clad plate electroplating device

Abstract

The invention relates to the field of copper-clad plate electroplating equipment, in particular to a flexible copper-clad plate electroplating device. The flexible copper-clad plate electroplating device comprises an electroplating tank, an evaporation concentrator, a dryer, a conveying mechanism, a water-washing mechanism, a water absorbing mechanism and a preheating mechanism, wherein the electroplating tank and the water-washing mechanism are arranged adjacent to each other and are both positioned below the conveying mechanism; the evaporation concentrator is positioned besides the electroplating tank; a first liquid inlet pipe is arranged between the water-washing mechanism and the evaporation concentrator; a first liquid inlet pump is arranged on the first liquid inlet pipe; a liquidpassing pipe is arranged on one side of the electroplating tank; a first connecting pipe is arranged between the evaporation concentrator and the liquid passing pipe; the preheating mechanism comprises a recovery assembly and a preheating assembly; the recovery assembly is arranged above the electroplating tank and is connected with the preheating assembly; and the water absorbing mechanism comprises a water absorbing assembly, a first extrusion assembly and a second extrusion assembly. According to the flexible copper-clad plate electroplating device, the waste of raw materials can be effectively reduced, the cost is saved, the environment is protected, the equipment configuration is complete, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the field of copper-clad laminate electroplating equipment, in particular to a flexible copper-clad laminate electroplating device. Background technique [0002] Flexible copper-clad laminate refers to a copper-clad laminate formed by bonding one or both sides of flexible insulating materials such as polyester film or polyimide film to copper foil through a certain process. It is characterized by thinness, lightness and flexibility. FPC using FCCL as the substrate material is widely used in electronic products such as mobile phones, digital cameras, digital video cameras, automotive satellite direction positioning devices, LCD TVs, and notebook computers. [0003] The electroplating method is one of the methods for producing flexible copper-clad laminates. The Chinese patent number CN207828434U discloses a flexible copper-clad laminate electroplating device, which includes a base. The upper end of the base is provided with an ...

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Problems solved by technology

[0004] However, the above-mentioned patent still has the following technical problems when in use; first, the above-mentioned patent squeezes the electroplated flexible copper-clad laminate through a squeeze roller during use, thereby removing excess on the electroplated flexible copper-clad laminate surface. The electroplating solution is extruded, which is convenient for later drying. However, the surface metal of the flexible copper clad laminate will collide and rub against the extrusion roller, which will easily cause damage to the flexible copper clad laminate and affect the quality of the product.

Second, the structure of the electroplating equipment for flexible copper-clad laminates in the above patents is relatively simple, which will waste a lot of raw materials and increase production costs, and the acid mist generated during the electroplating process cannot be effectively absorbed, which will affect the production environment and cause pollution. worker bodily injury

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