Display panel and display device
A technology for display panels and array substrates, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of high side bonding contact resistance, poor reliability, and limited bonding pin area, so as to prevent poor contact or even open circuit , The effect of improving the yield rate
Inactive Publication Date: 2020-03-27
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
The difficulty of side bonding is that due to the limited area of the bonding pins crimped on the side of the panel and the COF, and the unavoidable gap between the upper and lower substrates, the side bonding contact impedance is too high, which will eventually affect Product follow-up quality, life and reliability
[0004] Therefore, it is necessary to propose a new display panel and display device, which can reduce the gap between the upper and lower substrates, and solve the problems of poor quality, short life and poor reliability of the display panel in the prior art.
Method used
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[0025] The following description of the various embodiments refers to the accompanying drawings to illustrate specific embodiments in which the present invention may be practiced. The directional terms mentioned in the present invention, such as up, down, front, back, left, right, inside, outside, side, etc., are only directions referring to the drawings. The component names mentioned in the present invention, such as first, second, etc., are only used to distinguish different components, which can be better expressed. In the figures, structurally similar elements are denoted by the same reference numerals.
[0026] Embodiments of the present invention will be described in detail herein with reference to the accompanying drawings. This invention may be embodied in many different forms and should not be construed as only the specific embodiments set forth herein. These embodiments are provided to explain the practical application of the invention, so that others skilled in th...
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The invention provides a display panel and a display device. The display panel comprises an array substrate, a binding layer and a glass cover plate, a layered structure is arranged in a binding areaof the display panel and is provided with a first metal layer and a second metal layer, and the structure, such as an organic layer, an insulating layer, etc., is reserved. The first metal layer and the second metal layer can be connected through a through hole, and a binding lead is arranged in the first metal layer or the second metal layer. By making up a gap between the array substrate and thecover plate to a certain extent, the pins on a flexible circuit board can be supported when the subsequent metal wire transfer printing and binding lead alignment crimping are carried out, the poor contact and even open circuit caused by the fact that the metal wires collapse into the panel through the gaps are prevented, and the yield of the display panel (side Bonding) can be improved.
Description
technical field [0001] The present invention relates to the display field, in particular to a display panel and a display device. Background technique [0002] With the rapid development of the Internet of Things and 5G technology, and the gradual advancement of a series of application scenarios such as smart education, smart retail, smart medical care, smart transportation, and smart government affairs, the commercial display market will become the blue ocean of the display industry in the future. While the commercial display market has become a new driving force for panel manufacturers, the market has also put forward higher requirements for narrower joints in commercial display splicing screens. [0003] In the technical route of realizing extremely narrow frame products, the gate driver on array (GOA) circuit of the array substrate is limited due to its own size reduction, and a more feasible solution is to use the traditional chip on film (Chip on Flim, COF) and side b...
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IPC IPC(8): H01L27/12
CPCH01L27/124H01L27/1244
Inventor 侯继达
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD