Method for connecting SiC/SiC composite material through pin
A composite material and pin connection technology, which is applied in the direction of thin plate connection, connection components, mechanical equipment, etc., can solve the problems of connection surface offset, gap increase, etc., to improve applicability, shorten molding cycle, and simplify process flow Effect
Inactive Publication Date: 2020-04-07
AVIC COMPOSITES +1
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Problems solved by technology
[0005] Based on the above problems, the purpose of the present invention is to provide a fast and reliable method for connecting SiC / SiC composite materials with pins. , connection surface offset and other issues, to achieve stable pre-forming before high-temperature connection, to ensure that the connection surface is connected under precise alignment, to improve the efficiency of pin connection, and to promote the engineering application of SiC / SiC composite pin fastening connection
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[0024] specific implementation plan
[0025] The technical scheme of the present invention will be described in further detail below in conjunction with accompanying drawing and embodiment:
[0026] See attached figure 1 , 2 As shown, in this embodiment, the SiC / SiC composite material plate prepared by the PIP process is used as the connecting part 3 and the connected part 4, and the SiC / SiC composite material pin 5 is used as the fastener, and the vacuum bag is used for single nail connection. The combined process of molding and in-situ silicon-carbon reaction connects the SiC / SiC composite material plate 3 and the plate 4 to obtain a SiC / SiC composite material connected body.
[0027] The diameter of the pin hole on the connecting piece 3 and the connected piece 4 is 0.10 mm larger than that of the pin 5 .
[0028] The steps of the above-mentioned method for connecting SiC / SiC composite materials with pins are as follows:
[0029] (1) Preparation of silicon-carbon precur...
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Abstract
The invention relates to a method for connecting a SiC / SiC composite material through a pin. The method adopts a vacuum bag forming process to stablize and shape a connector, effectively solves the problems of connecting surface deviation, low connecting efficiency and the like of the connector caused by human uncontrollable shaking or airflow in the furnace and other factors, avoids the situationthat in the prior art, bonding treatment or a mold is needed to ensure a correct assembling mode of the connector during bonding, the technological process is simplified, the cost is lowered, and theapplicability of SiC / SiC composite material connection is improved.
Description
technical field [0001] The invention relates to a method for connecting SiC / SiC composite materials with pins. The method utilizes a combined process of a vacuum bag forming process and an in-situ silicon-carbon reaction process to realize the pin connection of SiC / SiC composite materials, and is suitable for large and complex SiC / SiC Connection of composite components. Background technique [0002] The preparation technology of high-temperature resistant complex thin-walled components is an important development direction in the fields of aviation, aerospace engines and internal and external thermal protection systems of aerospace vehicles. The SiC / SiC composite material has the advantages of low density, high temperature resistance, high strength, oxidation resistance, corrosion resistance, impact resistance, low tritium permeability and radiation stability, and has become the material of choice for high temperature resistant complex thin-walled components. Since the larg...
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IPC IPC(8): C04B37/00F16B5/10
CPCC04B37/003C04B2237/083C04B2237/365C04B2237/55F16B5/10
Inventor 刘时剑
Owner AVIC COMPOSITES