Ultrathin vapor chamber with composite wick structure and manufacturing method of ultrathin vapor chamber

Abstract

The invention discloses an ultrathin vapor chamber with a composite wick structure and a manufacturing method of the ultrathin vapor chamber. The ultrathin vapor chamber comprises an evaporation plateand a condensation plate; a cavity is formed in the inner surface of the evaporation plate, and a first capillary structure and a second capillary structure are arranged in the cavity; the first capillary structure is a micro-channel channel structure integrally machined with the evaporation plate, and the second capillary structure is a porous metal structure formed through sintering; a third capillary structure is arranged on the inner surface of the condensation plate, and the third capillary structure is provided with radial circumferential array micro-channels. The manufacturing method comprises the steps of integrated machining of the evaporation plate cavity and the first capillary structure, sintering of the second capillary structure, machining of the condensation plate, cleaningand seal welding, and vacuumizing and liquid injection. The vapor chamber with the composite wick structure has the advantages of being small in thickness, large in permeability, large in supportingstrength, high in heat dissipation efficiency and reversible in gravity.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of microelectronic devices, in particular to an ultra-thin vapor chamber with a composite liquid-absorbing core structure and a manufacturing method thereof. Background technique [0002] With the integration and complex functions of electronic devices, the calorific value per unit area of ​​electronic devices is getting higher and higher. How to realize efficient heat dissipation of high heat flux electronic devices has become the key to the development of electronic device technology. Vapor chamber, through the principle of phase change heat transfer, realizes the rapid diffusion of concentrated heat to a larger condensation surface, thereby effectively reducing the heat flux density of electronic equipment. It is for this reason that vapor chamber technology is favored by researchers in the field of cooling electronics. [0003] Existing vapor chambers are generally in the shape of a ...

AI Technical Summary

Problems solved by technology

[0004] 1. The existing vapor chamber generally retains the steam cavity as a steam diffusion channel. This structure has low strength and is easily deformed, resulting in poor contact, resulting in a sharp drop in heat dissipation performance of the vapor chamber

On the other hand, the existence of the steam chamber structure makes it more difficult to make the vapor chamber ultra-thin, and the processing is more complicated and the cost is higher

[0005] 2. Most of the existing vapor chamber liquid-absorbing cores are formed by porous metal sintering

This kind of liquid-absorbing core has large flow resistance, low permeability, and low heat dissipation efficiency.

[0006] 3. Some of the existing vapor chambers use channel-type liquid-absorbing cores, which have high permeability and small flow resistance, but the capillary suction is small, which cannot provide sufficient reflux power for the working fluid, which will reduce the heat dissipation efficiency of the vapor chamber

On the other hand, the existing channel-type liquid-absorbing core vapor chamber has poor anti-gravity effect and can only be installed horizontally

[0007] 4. The thickness of the existing vapor chamber is large, and if the thickness is reduced or a small stress deformation occurs, the thermal resistance will increase sharply

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