Solder removing tool
A solder and tooling technology, applied in the field of inner conductor processing, can solve the problems of low production and processing efficiency and low degree of automation, and achieve the effect of improving precision and processing efficiency
Active Publication Date: 2020-04-10
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology
[0003] The object of the present invention is to provide solder removal tooling, aiming to solve the problem of low automation of the device for removing excess solder and low production and processing efficiency
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[0045] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0046] see figure 1 and figure 2 , the solder removal tooling provided by the present invention will now be described. The solder removal tool includes: a frame 14 , a first clamping device 5 , a driving element, a second clamping device 1 , a control assembly 3 and a grinding device 4 . The first clamping device 5 is rotatably arranged on the frame 14, and the first clamping device 5 is used to clamp the cable assembly 2; the driving member is connected to the first clamping device 5 in transmission, and is used to drive the first clamping device 5 to rotate ....
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The invention provides a solder removing tool, and belongs to the technical field of inner conductor processing. The solder removing tool comprises a rack, a first clamping device, a driving piece, asecond clamping device, a control assembly and a grinding device. The driving piece is in transmission connection with the first clamping device and used for driving the first clamping device to rotate. The second clamping device and the first clamping device are arranged at a certain interval; the second clamping device is used for clamping an inner conductor at the end part of a cable assembly;and the second clamping device is used for being rotationally connected with the inner conductor. The control assembly is arranged on the side, away from the first clamping device, of the second clamping device. The grinding device is arranged between the first clamping device and the second clamping device; the driving piece drives the cable assembly to rotate by means of the first clamping device; and the control assembly is electrically connected with the driving piece and the grinding device, and the control assembly controls the driving piece and the grinding device to operate. Accordingto the solder removing tool, the machining precision and the machining efficiency are improved.
Description
technical field [0001] The invention belongs to the technical field of inner conductor processing, and more specifically relates to a solder removal tool. Background technique [0002] The cable assembly is a device mainly responsible for exchanging data information with the outside world. In order to avoid data loss during information transmission, high requirements are placed on the processing technology of cable assemblies. The end of the cable assembly is an inner conductor, and excess solder will overflow from the inspection hole of the inner conductor during the installation of the inner conductor. The residual amount of solder will affect the frequency and life of the cable assembly. The tin that emerges from the inspection hole should be scraped off to the greatest extent under the premise of ensuring that the gold layer on the surface of the inner conductor is not damaged, otherwise the soldering quality of the solder joint will be affected. At present, there are ...
Claims
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IPC IPC(8): B24B27/033B24B41/06B24B47/12B24B47/22B24B49/04B24B51/00
CPCB24B27/033B24B41/062B24B47/12B24B47/22B24B49/04B24B51/00
Inventor 杨树国左国森张辉韩康达孙涛李焰峰刘帅赵玮胡文浩张超胡惠东谢娜赵亚梦
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP