Tile cutting device

A cutting device and a technology for ceramic tiles, applied in the field of ceramic tile processing, can solve the problems of high labor intensity, poor position accuracy, poor flatness of ceramic tile cutting, etc.

Inactive Publication Date: 2020-04-10
TONGXIANG XILIANG TIN CANS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two cutting methods are currently the most mainstream cutting methods. In the tile laying process, masons usually hold the cutting machine directly to cut, but this cutting method has poor flatness and position accuracy for the tiles. Poor, but the cutting is generally carried out directly on the countertop, and the tiles need to be manually transported to the countertop before cutting, and the tiles are generally heavy and labor-intensive

Method used

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  • Tile cutting device
  • Tile cutting device
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Examples

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are explanations of the present invention and the present invention is not limited to the following examples.

[0021] Such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, a tile cutting device includes a cutting platform 1, a cutting leg 2, and a cutting universal wheel 3. The cutting leg 2 is installed on the lower end of the cutting platform 1, and the cutting universal wheel 3 is arranged on the cutting support Below the leg 2, the cutting universal wheel 3 is provided with a self-locking device, which can realize the locking of the cutting universal wheel 3 and improve the stability of processing. It also includes a positioning mechanism 4, a clamping mechanism 5, a cutting mechanism 6, and a feeding mechanism 7. The cutting platform 1 is equidistantly pro...

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PUM

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Abstract

The invention provides a tile cutting device and belongs to the technical field of processing of tiles. The tile cutting device comprises a positioning mechanism, a clamping mechanism, a cutting mechanism and a feeding mechanism, wherein push-pull clamps of the clamping mechanism are mounted on clamping and supporting blocks; cutting, transverse shifting and sliding blocks of the cutting mechanismare slidably arranged on cutting, transverse shifting and sliding guide rods; cutting and transverse shifting screws are connected with cutting, transverse shifting and sliding block screws; feedingsliding block support seats are slidably arranged on feeding guide rails of feeding support frames; a feeding sliding gear and a feeding sliding rack are meshed with each other; feeding suction cups are uniformly distributed and mounted on the lower side of a feeding rotation table; a diagonal positioning frame support plate turning pin is inserted into a turning hole of a diagonal positioning frame support plate of the positioning mechanism and is fastened by a diagonal positioning frame support plate fastening screws; and a diagonal positioning frame is mounted on the diagonal positioning frame support plate. The tile cutting device is capable of quickly achieving parallel cutting and diagonal cutting of the tiles; meanwhile, tile cutting device is high in tile cutting position accuracyand high in cutting flatness.

Description

technical field [0001] The invention relates to the technical field of tile processing, in particular to a tile cutting device. Background technique [0002] Ceramic tile is a kind of acid and alkali resistant porcelain or stone, construction or decoration materials formed by grinding, mixing, pressing, glazing and sintering of refractory metal oxides and semi-metal oxides. The raw materials are mostly mixed with clay, quartz sand, etc. Ceramic tiles can be divided into: polished tiles, antique tiles, porcelain tiles, full glazed tiles, polished crystal tiles, microcrystalline stones, split tiles, square tiles, etc. according to their varieties. The common specifications of tiles are 300x300mm, 300x600mm, 400x400mm, 500x500mm, 600x600mm, 800x800mm and so on. In the tile laying process, it needs to be cut according to the laying position. The general cutting method is generally divided into two types: 1. Parallel cutting, that is, parallel cutting along the edge of the tile...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/24B28D7/04B28D7/00
CPCB28D1/24B28D7/00B28D7/043B28D7/046
Inventor 李伟旭
Owner TONGXIANG XILIANG TIN CANS
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