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Method for realizing full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes

A technology of hexadecimal and product manufacturing, which is applied to the record carrier used by the machine, the induction record carrier, the printed circuit, etc., can solve the problem of the inability to realize the ID association between the inner core board and the outer layer board, and the code cannot be recognized. , affecting manufacturing capacity and other issues, to achieve the effect of improving recognition efficiency and recognition rate, improving recognizable efficiency, and meeting production capacity requirements

Inactive Publication Date: 2020-04-10
南京品微智能科技有限公司
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AI Technical Summary

Problems solved by technology

[0007] 1. The outer layer board is formed by stacking multiple inner layer core boards by hot pressing. Due to the process requirements, the inner core board needs to be covered with PP film before lamination, so it is impossible to realize the ID of the inner layer core board and the outer layer board. association;
[0008] 2. At present, laser one-dimensional codes or two-dimensional codes are generally used in the form of ID coding of products and products in progress. However, due to the PCB's electroplating and etching process in product manufacturing, the codes are easily covered, polluted or even damaged, resulting in codes that cannot be coded. Recognition or low recognition rate;
[0009] 3. The one-dimensional code or two-dimensional code has more pixels, and the coding efficiency is relatively low, which seriously affects the manufacturing capacity;
[0010] 4. Since the product and WIP ID are only coded on the surface, only front lighting can be used for code code information collection, which is greatly affected by the lighting environment of the working condition, resulting in low recognition efficiency

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  • Method for realizing full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes
  • Method for realizing full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes
  • Method for realizing full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0046] refer to Figure 1-3 , the present invention provides a technical solution: a method for realizing the traceability of the whole process of PCB product manufacturing based on the hexadecimal dot matrix hole code, characterized in that: comprising the following steps:

[0047] S1: Inner core board sequence code, transcoding, dot matrix code generation and coding;

[0048] A1: Inner core board serial code, transcoding, dot matrix code generation method: Automatically generate the inner core board ID serial number according to the number of inner core board work orders, first convert the decimal ID serial number to hexadecimal , and then converted into a binary ...

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Abstract

The invention discloses a method for realizing the full-process tracing of PCB product manufacturing based on hexadecimal lattice hole codes. The method comprises the following steps that: S1, the sequence code of an inner-layer core board is generated, transcoding is performed, a lattice code is generated, and code assignment is performed; S2, the association of the inner-layer core board with anouter-layer board and the sequence code production of the outer-layer board are performed, the inner-layer core board is associated with an outer-layer board, specifically, inner-layer core board tracing codes are identified and analyzed through a photoelectric analysis module in an overlapping and pre-arranging process, inner-layer core board ID sequence numbers are associated according to a product process, and a new outer-layer board ID sequence number is automatically generated according to groups; S3, the transcoding of the outer-layer board is performed, a dot matrix code is generated,and code assignment is performed; S4, tracing code reading is performed; and S5, a tracing system is established. Therefore, the association of the IDs of the inner-layer core board and the outer-layer core board is realized, and the full-process tracing of a PCB from the inner layer to the outer layer is realized.

Description

technical field [0001] The invention relates to the technical field of traceability of the whole process of PCB product manufacturing, in particular to a method for realizing traceability of the whole process of PCB product manufacturing based on hexadecimal dot matrix hole codes. Background technique [0002] With the development of the electronic circuit industry, the design and process of PCB products are becoming more and more complex, and the requirements for product manufacturing quality control are also constantly improving; manufacturing companies in the electronic circuit industry belong to high-end discrete manufacturing, with multi-variety, small batch, The characteristics of make-to-order production include the coexistence of production and research, mixed-line production, continuous changes in the process, and constant switching of main and auxiliary materials. It is necessary to quickly present the factor information of each process in the product manufacturing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/06G06K7/10G06Q30/00H05K1/02
CPCG06K19/06037G06K7/10821G06Q30/018H05K1/0269H05K2201/09927
Inventor 陆晓杰
Owner 南京品微智能科技有限公司
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