Array substrate and preparation method thereof, display panel and display device
An array substrate and substrate technology, which is applied in the field of display devices, can solve problems such as metal layer bulging, product quality cannot be guaranteed, and metal layer film peeling off.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0070] The present invention firstly provides a method for preparing an array substrate, referring to Figure 5 Shown is a schematic flow diagram of an embodiment of the method for preparing an array substrate of the present invention; the method for preparing an array substrate may include the following steps:
[0071] Step S10 , providing a substrate 1 .
[0072] Step S20 , forming a first electrode layer 8 on the substrate 1 .
[0073] Step S30 , forming a conductive layer 9 on a side of the first electrode layer 8 facing away from the substrate 1 .
[0074] Step S40 , patterning the conductor layer 9 to form a conductor pattern 91 .
[0075] Step S50 , patterning the first electrode layer 8 to form a first electrode 81 .
[0076] Each step of the method for preparing the array substrate of the present invention will be described in detail below through three example implementations.
Embodiment approach 1
[0078] In this example implementation, refer to Figure 6 As shown, a substrate 1 is provided, and the substrate 1 may be a glass substrate. The organic film layer 7 is formed on the substrate 1 by means of deposition, evaporation or sputtering. The first electrode layer 8 is formed on the side of the organic film layer away from the substrate 1 by deposition, evaporation or sputtering. The material of the first electrode layer 8 can be ITO (indium tin oxide). A conductive layer 9 is formed on the side of the first electrode layer 8 facing away from the substrate 1 by deposition, vapor deposition or sputtering, and the material of the conductive layer 9 can be metal copper, silver or the like. refer to Figure 7 As shown, the conductor layer 9 is patterned to form a conductor pattern 91, and the patterning process may be a photolithography process. refer to Figure 8 As shown, the first electrode layer 8 is patterned to form the first electrode 81, and the patterning proce...
Embodiment approach 2
[0081] In this example implementation, refer to Figure 9 As shown, a substrate 1 is provided, and the substrate 1 may be a glass substrate. The organic film layer 7 is formed on the substrate 1 by means of deposition, evaporation or sputtering. The first electrode layer 8 is formed on the side of the organic film layer away from the substrate 1 by deposition, evaporation or sputtering. The material of the first electrode layer 8 can be ITO (indium tin oxide). A conductive layer 9 is formed on the side of the first electrode layer 8 facing away from the substrate 1 by deposition, vapor deposition or sputtering, and the material of the conductive layer 9 can be metal copper, silver or the like. refer to Figure 10 As shown, the conductor layer 9 is patterned to form a conductor pattern 91, and the patterning process may be a photolithography process.
[0082] refer to Figure 11 As shown, the second electrode layer 10 is formed on the side of the conductor pattern 91 and th...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More