Chemical mechanical polishing device with protection function

Abstract

The invention discloses a chemical mechanical polishing device with a protection function. The device comprises a polishing table, a clamping groove, a liquid dropping device and a second electric push rod, a polishing disc is arranged on the top of the polishing table, a protection cover is arranged on the outer side of the polishing disc, a sound insulation cotton is arranged on the inner side of the protection cover, a fixed column is fixed to the bottom of the protection cover, the fixed column is mounted in a fixed groove, the fixed groove is formed in the top of the polishing table, clamping bolts are fixed to the two ends of the bottom of the protection cover and are mounted in the clamping groove, a column hole is formed in the inner side of the clamping groove, a locking column ismounted in the column hole, and one end of the locking column is arranged on the side faces of the clamping bolts. The chemical mechanical polishing device with the protection function is provided with the protection cover, when the rotating speed of the polishing disc is too fast, polishing liquid can be splashed out, through the protection cover, the polishing liquid is prevented from being splashed, the polishing liquid can be prevented from polluting the polishing table, and meanwhile, the polishing disc is prevented from rotating and hurting a worker.

Description

technical field [0001] The invention relates to the technical field of polishing equipment, in particular to a chemical mechanical polishing equipment with protection function. Background technique [0002] Chemical mechanical polishing technology is a means of obtaining global planarization in integrated circuit manufacturing. This process is specially designed to obtain a surface that is both flat and free from scratches and impurities. Using this process for polishing operations, It can further increase the quality of polishing and improve the polishing efficiency. Here, we will study a chemical mechanical polishing equipment. We hope that through continuous research and improvement of this chemical mechanical polishing equipment, it can help us use this equipment more conveniently. At the same time, the polishing quality and efficiency of the workpiece are further improved. [0003] Although there are many types of chemical mechanical polishing equipment, many chemical ...

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Problems solved by technology

[0004] The object of the present invention is to provide a kind of chemical mechanical polishing equipment with protective function, to solve the problem that the chemical mechanical polishing equipment on the market proposed by the above background technology has no protective function when the grinding and polishing speed is too high, resulting in polishing during polishing. The liquid is easy to splash and pollute the polishing table, which is difficult to clean

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