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Silicon wafer cutting cooling liquid recycling method

A technology for cutting and reusing silicon wafers, which is applied to fine working devices, working accessories, manufacturing tools, etc., and can solve the problems of large amount of slurry, high cost, and rising

Inactive Publication Date: 2020-04-17
无锡荣能半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, both monocrystalline and polycrystalline silicon wafers are polished and cut with diamond wires. During the cutting process, it is necessary to add a slurry composed of pure water and cooling liquid in a certain proportion to the slicer, and pump it into the cutting machine through a pump and pipeline. The chamber cools and lubricates the cutting process, and plays a role in suspending and dispersing the silicon powder produced during the cutting process. The amount of slurry used is large and the cost is high. At present, the used slurry in the cutting room of some enterprises will pass a series of physical and chemical methods. Carry out recycling treatment, and then add a certain proportion of fresh cooling liquid and pure water before continuing to reuse; the recycling process will cause the loss of some components in the slurry, so its performance will change, and it will cause silicon wafer cutting to occur during recycling. Abnormalities such as broken wires and dirty chips increase

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The method for reusing the silicon wafer cutting cooling slurry of the present embodiment comprises the following steps:

[0018] 1) Slurry mixing: The newly configured cooling slurry prepared by pure water and cooling liquid is first injected into the cutting chamber through pumps and pipelines to cool and lubricate the cutting process, and the silicon powder generated during the cutting process is activated. to suspension and dispersion; the newly configured cooling slurry is discharged from the cutting chamber after being processed in the cutting chamber, and the recovered cooling slurry is formed after processing, and the recovered cooling slurry and the newly configured cooling slurry are sent into the mixing chamber together to make the recovered cooling slurry and The newly configured cooling slurry is fully mixed, and the ratio of the recycled cooling slurry to the newly configured cooling slurry is 3:1 to form a reused cooling slurry;

[0019] 2) Sampling test:...

Embodiment 2

[0022] The method for reusing the silicon wafer cutting cooling slurry of the present embodiment comprises the following steps:

[0023] 1) Slurry mixing: The newly configured cooling slurry prepared by pure water and cooling liquid is first injected into the cutting chamber through pumps and pipelines to cool and lubricate the cutting process, and the silicon powder generated during the cutting process is activated. to suspension and dispersion; the newly configured cooling slurry is discharged from the cutting chamber after being processed in the cutting chamber, and the recovered cooling slurry is formed after processing, and the recovered cooling slurry and the newly configured cooling slurry are sent into the mixing chamber together to make the recovered cooling slurry and The newly configured cooling slurry is fully mixed, and the ratio of the recycled cooling slurry to the newly configured cooling slurry is 2:1 to form a reused cooling slurry;

[0024] 2) Sampling test:...

Embodiment 3

[0027] The method for reusing the silicon wafer cutting cooling slurry of the present embodiment comprises the following steps:

[0028] 1) Slurry mixing: The newly configured cooling slurry prepared by pure water and cooling liquid is first injected into the cutting chamber through pumps and pipelines to cool and lubricate the cutting process, and the silicon powder generated during the cutting process is activated. to suspension and dispersion; the newly configured cooling slurry is discharged from the cutting chamber after being processed in the cutting chamber, and the recovered cooling slurry is formed after processing, and the recovered cooling slurry and the newly configured cooling slurry are sent into the mixing chamber together to make the recovered cooling slurry and The newly configured cooling slurry is fully mixed, and the ratio of the recycled cooling slurry to the newly configured cooling slurry is 1:1 to form a reused cooling slurry;

[0029] 2) Sampling test:...

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Abstract

The invention relates to a silicon wafer cutting cooling liquid recycling method. Recycled cooling liquid and newly-prepared cooling liquid are mixed according to the proportion of (3-1):1 to form recycling cooling liquid, sampling detection is conducted on the COD, the surface tension, the electrical conductivity and the pH value, the recycling cooling liquid can be applied to a cutting chamber after detection results reach the standards, and the line breakage rate and the silicon wafer fouling rate can be decreased.

Description

technical field [0001] The invention relates to a method for producing silicon wafers, in particular to a method for reusing silicon wafer cutting cooling slurry. Background technique [0002] At present, both monocrystalline and polycrystalline silicon wafers are polished and cut with diamond wires. During the cutting process, it is necessary to add a slurry composed of pure water and cooling liquid in a certain proportion to the slicer, and pump it into the cutting machine through a pump and pipeline. The chamber cools and lubricates the cutting process, and plays a role in suspending and dispersing the silicon powder produced during the cutting process. The amount of slurry used is large and the cost is high. At present, the used slurry in the cutting room of some enterprises will pass a series of physical and chemical methods. Carry out recycling treatment, and then add a certain proportion of fresh cooling liquid and pure water before continuing to reuse; the recycling ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D7/02B28D7/00C10M175/00
CPCB28D5/0058B28D5/0076C10M175/00
Inventor 冯震坤
Owner 无锡荣能半导体材料有限公司
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