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Rapid warming device for bottled solder paste

A solder paste, fast technology, applied in the field of bottled solder paste rapid return temperature device, can solve the problems of slow return temperature, extensive return temperature control method, scrapping, etc., and achieve the effect of avoiding scrapping

Pending Publication Date: 2020-04-21
台龙电子(昆山)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a bottled solder paste rapid return temperature device to solve the problem of slow self-return temperature of the solder paste at room temperature in the prior art, and the control method of return temperature is too extensive. It is impossible to ensure that the solder paste used is the one with the longest reheating time, which often leads to the technical problem that the first rewarmed solder paste is scrapped due to untimely use

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  • Rapid warming device for bottled solder paste
  • Rapid warming device for bottled solder paste
  • Rapid warming device for bottled solder paste

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0022] It should be noted that, in the description of the present invention, the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer" and the like indicate orientations or positions The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and does not require that the present invention must be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. The terms "front", "rear", "left", "right", "upper" and "lower" used in the description of the present invention refer to the directions in the drawings, ...

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Abstract

The invention discloses a rapid warming device for bottled solder paste. According to the prior art, the self-warming speed of solder paste placed under a room temperature condition is low; and a warming control mode is too extensive and fails to guarantee that solder paste under use is the solder paste with the longest warming time, and as a result, the solder paste which is warmed at first is often scrapped due to the fact that the solder paste which is warmed at first is not used in time. The invention just aims to solve the above technical problems in the prior art. The rapid warming device comprises a warming box with an upward-facing opening; the warming box comprises a slope-shaped inner bottom plate used for containing the bottled solder paste; a discharging port is formed in the side face of the warming box and faces the slope bottom end of the inner bottom plate; the discharging port is movably connected with a discharging tray used for containing and limiting the bottled solder paste; and an electric heating module is arranged at the bottom of the warming box.

Description

technical field [0001] The invention relates to a quick warming device for bottled solder paste, which belongs to the technical field of solder paste warming. Background technique [0002] Solder paste is a paste-like stable mixture composed of alloy solder powder, flux carrier, etc. In the surface mount process, it plays the role of cementing components to promote solder wetting, removing oxides and trace impurities, and preventing surface re-oxidation. Due to the characteristics of solder paste itself, in order to slow down the reaction speed of flux and solder powder and prolong its storage time, solder paste needs to be stored in a refrigerator at 2-10°C, usually at 3-6°C. When in use, when the solder paste is taken out of the refrigerator, its temperature is usually lower than room temperature. If it is unpacked without "warming" treatment, it is easy to condense the water vapor in the nearby air and adhere to the solder paste. When the solder paste with water vapor is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08
CPCB23K3/08
Inventor 李妙玲
Owner 台龙电子(昆山)有限公司
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