Monitoring device and silicon wafer processing device

Abstract

The invention provides a monitoring device and a silicon wafer processing device. The monitoring device comprises a light source and a screen, wherein the light source is arranged on one side of a grinding wheel; a grinding groove extending in the circumferential direction of the grinding wheel is formed in the grinding wheel; the edge of a silicon wafer is placed in the grinding groove to grind the silicon wafer; the light source is used for projecting light to the grinding wheel; the screen and the light source are arranged in a spaced mode; the screen is arranged on the other side of the grinding wheel; and when the light source projects light to the grinding wheel, the grinding wheel forms a projection image on the screen. According to the monitoring device, whether silicon chips existin the grinding groove in the grinding wheel or are damaged or not can be monitored through the projection image of the grinding wheel on the screen, when the grinding wheel grinds or the silicon chips are accumulated in the grinding groove, the silicon chips can be found in time through the projection image of the grinding wheel on the screen, adjustment is made in time, the chamfering machiningquality is effectively controlled, the machining shape of the edge chamfer of the silicon wafer is prevented from being affected, machining defects of many silicon wafers are avoided, and the machining quality of the silicon wafers is improved.

Description

technical field [0001] The invention relates to the field of silicon wafer processing, in particular to a monitoring device and a silicon wafer processing device. Background technique [0002] As the most basic material in the semiconductor field, wafers can be processed into various circuit element structures on their surfaces, and become integrated circuit products with specific electrical functions. Large-sized wafers have many preparation procedures and complex processes. The final monocrystalline silicon wafers require no defects inside the surface, and have extremely small flatness, roughness, and surface particle counts, and the cost is extremely high. Among them, the edge chamfering and grinding of single crystal silicon wafers is very important. Silicon wafers are brittle and have high hardness. Small cracks or cracks on the edges will generate mechanical stress on the silicon wafers, resulting in dislocations, resulting in the accumulation of harmful contaminants a...

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Problems solved by technology

[0004] In view of this, the present invention provides a monitoring device and a silicon wafer processing device to solve the problem that it is difficult to find out in time when the grinding wheel is worn, the diamond particles are peeled off, or silicon chips are accumulated in the groove during the chamfering process of the grinding wheel. , which seriously affects the processing shape of the edge chamfer of the silicon wafer, causes more processing defects of the silicon wafer, and reduces the processing quality of the silicon wafer

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