Substrate processing apparatus and substrate processing method

a processing apparatus and substrate technology, applied in lighting and heating apparatus, cleaning equipment, combustion types, etc., can solve the problems of chemical liquid supply conditions changing, and the drop of chemical liquid on the substrate, so as to prevent the formation of chemical liquid deposits on the substrate. , the effect of processing defects in substrates

Inactive Publication Date: 2007-06-14
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014] An object of the invention is to provide a substrate processing apparatus and a substrate processing method in which processing defects in a substrate due to a deposit formed on a nozzle are sufficiently prevented.

Problems solved by technology

In this case, the deposit that has grown drops on the substrate from the nozzle, or the supply conditions of the chemical liquid supplied from the nozzle to the substrate are changed so that processing defects occur in the substrate.
As a result, the problems that the deposit drops on the substrate and the supply conditions of the chemical liquid are changed are not sufficiently solved.

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Embodiment Construction

[0112] A substrate processing apparatus according to embodiments of the present invention will be now described with reference to the drawings.

[0113] In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a PDP (Plasma Display Panel), a glass substrate for a photo mask, a glass substrate for an optical disk, or the like.

(1) CONFIGURATION OF SUBSTRATE PROCESSING APPARATUS

[0114]FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, a substrate processing apparatus 100 has processing regions A and B, and a transport region C between the processing regions A and B.

[0115] A control unit 4, fluid boxes 2a and 2b, a cleaning processing units 5a and 5b are arranged in the processing region A.

[0116] Each of the fluid boxes 2a and 2b shown in FIG. 1 stores fluid-related equipment such as pipes, joints, valves, flow meters, r...

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Abstract

A substrate processing apparatus comprises a multifunctional nozzle having a double-pipe structure. An inner flow path of the multifunctional nozzle is connected to a first supply suction system through a supply suction pipe. An outer flow path is connected to a second supply suction system through the supply suction pipe. The first supply suction system and the second supply suction system have respectively chemical liquid supply sources, rinse liquid supply sources, inert gas supply sources, and ejectors. Such a configuration makes it possible to selectively supply the chemical liquid, supply the rinse liquid, and supply the inert gas and suck in through the inner flow path and the outer flow path of the multifunctional nozzle.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus and a substrate processing method that subject a substrate to predetermined processing. [0003] 2. Description of the Background Art [0004] Substrate processing apparatuses have been conventionally used to subject various types of substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, and glass substrates for optical disks, and other substrates to various types of processing. [0005] In the substrate processing apparatuses, a chemical liquid using BHF (buffered hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, ammonia, or the like is supplied to the substrate, to subject the substrate to surface processing (hereinafter referred to as chemical liquid processing). [0006] In the subs...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A47L5/00
CPCH01L21/67051H01L21/6708
Inventor YAMADA, KUNIOHARA, TAKASHI
Owner DAINIPPON SCREEN MTG CO LTD
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