The embodiment of the invention provides an LCP
millimeter wave radar circuit board
processing control method and device. The method comprises the steps that LCP material parameters, spraying material parameters and FR4 material parameters are acquired; preset hole
machining parameters are obtained, and
machining technology and defect parameters in the preset hole
machining parameters are extracted; forming a
data set by the LCP material parameters, the spraying material parameters, the FR4 material parameters and the
processing technology and defect parameters; inputting the
data set into a neural
network model for training to obtain a trained neural
network model; new LCP material parameters, spraying material parameters and FR4 material parameters are input into the trained neural
network model, and output preset hole machining parameters are obtained; according to the preset hole machining parameters, spraying and drilling operation of the
millimeter wave radar circuit board is carried out; the
processing defects of burrs, curled edges and the like of the circuit board are avoided, the processing and manufacturing yield is improved, and the problems that materials cannot be completely
cut off easily when a CNC forming
milling cutter is used for processing and
cutting, and curled edges and burrs are caused when the
milling cutter pulls LCP materials are solved.