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M2M module test method and device

A technology of module testing and testing needles, which is applied in the direction of measuring devices, measuring device casings, electronic circuit testing, etc., can solve problems such as M2M module damage, pin function failure, chip damage, etc., to reduce test risks and save test time Effect

Inactive Publication Date: 2020-04-28
FIBOCOM WIRELESS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Since it is necessary to connect each pin of the module to the DAQ, it is easy to introduce some high-energy voltage when the lead wire is in contact with the outside world, which will damage the internal chip of the module. At the same time, due to various complex environments outside, many factors (static electricity, surge) will pass If the M2M module is damaged due to this method, the corresponding production line will often report that the corresponding pin function of the M2M module is invalid, so the module has to be reworked or scrapped, resulting in production losses

Method used

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Embodiment Construction

[0033] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0034] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention relates to an M2M module test method and device. The M2M module comprises a control module and at least one function extension pin. The device comprises a test fixture, and the test fixture is electrically connected with the control module. Each function extension pin of the M2M module is connected to the test fixture through a connecting wire or a test needle. The control module isused for configuring each function extension pin as a universal input / output port during testing, then executing a test operation on each successfully configured function extension pin, and judging whether each function extension pin is normal or not according to a test result. On one hand, the function pin test of the M2M module can be realized, and on the other hand, the problem that the M2M module needs to be reworked or scrapped due to the fact that the pins of the M2M module are led out to the DAQ is avoided. Besides, since the pins of the M2M module do not need to be led out to the DAQ,repeated handshake, control and delay waiting between the pins and the DAQ can be correspondingly omitted, and the whole test time is saved.

Description

technical field [0001] The present invention relates to the technical field of circuit testing, in particular to an M2M module testing method and device. Background technique [0002] M2M (Machine to Machine) refers to a machine-to-machine connection and communication relationship in industrial equipment, and an M2M communication device is a device that realizes this communication relationship. At present, DAQ (Data acquisition, data acquisition) is usually used to test the pins of the M2M module. In order to implement the test, it is necessary to lead all the pins of the M2M module to the DAQ. [0003] Since it is necessary to connect each pin of the module to the DAQ, it is easy to introduce some high-energy voltage when the lead wire is in contact with the outside world, which will damage the internal chip of the module. At the same time, due to various complex environments outside, many factors (static electricity, surge) will pass If the M2M module is damaged due to th...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R1/04
CPCG01R1/0425G01R31/2851G01R31/2865
Inventor 叶新财
Owner FIBOCOM WIRELESS
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