A flexible film with adjustable infrared emissivity and its preparation method
A technology of infrared emissivity and flexible film, which is applied in diffusing elements, instruments, optics, etc., can solve the problems of inability to meet the application of special-shaped structures, deposition of flexible films, limited area size, etc., to increase the change value of infrared emissivity , The effect of high preparation efficiency and unlimited area size
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specific Embodiment approach 1
[0025] Specific implementation mode one: combine figure 1 Specifically, in this embodiment, a flexible film with adjustable infrared emissivity is sequentially composed of a highly reflective metal base layer, VO 2 Composition of composite layer and surface protection layer;
[0026] The VO 2 The composite layer consists of an infrared transparent matrix material and multiple micron-scale W-doped VO 2 Particle composition, micron-scale W-doped VO 2 The particles are distributed inside the infrared transparent matrix material; the micron-scale W-doped VO 2 The maximum size of the particles is 1 μm to 10 μm; the micron-scale W-doped VO 2 The mass ratio of the particles to the infrared transparent matrix material is (0.5-5):100; the micron-scale W-doped VO 2 W in the particle accounts for 0%-2.5% of the total atomic number of W and V.
[0027] The beneficial effects of this embodiment are:
[0028] (1) The present invention adopts a "bottom-up" method, specifically micron-...
specific Embodiment approach 2
[0032] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the highly reflective metal base layer is Al, Au, Ag, Mg, Ni, Zn or Cu; the surface protection layer is Al 2 o 3 , SiO 2 , ZrO 2 , Nb 2 o 5 , HfO 2 or TiO2 ; The infrared transparent base material is high-density polyethylene or hydrogenated styrene-butadiene block copolymer. Others are the same as in the first embodiment.
[0033] In this specific embodiment, the hydrogenated styrene-butadiene block copolymer is SEBS, and the high-density polyethylene is HDPE.
specific Embodiment approach 3
[0034] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that: the thickness of the highly reflective metal base layer is 100nm-500nm; the thickness of the surface protection layer is 50nm-200nm; VO 2 The thickness of the composite layer is 200 μm to 500 μm. Others are the same as in the first or second embodiment.
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