Die bonding pickup packaging device

Abstract

The invention discloses a die bonding pickup packaging device, which belongs to the technical field of chip packaging devices. The device is characterized by comprising a die adjusting device (57), achip separating device (4) and a chip conveying device (5), wherein the chip separating device (4) is arranged on the lower side of the die adjusting device (57), the chip conveying device (5) is arranged on the upper side of the die adjusting device (57), a die frame for clamping a die (13) is arranged on the die adjusting device (57), and a detection device is further arranged on the upper sideof the die adjusting device (57). According to the die bonding pickup packaging device disclosed in the invention, the die adjusting device can drive the die to rotate, therefore, the posture of the chip is adjusted, the corresponding positions of the chip and the lead frame can be ensured to be aligned, the chip conveying device can accurately convey the chip to the corresponding position of thelead frame, the chip placing accuracy is ensured to be good, the stability of chip die bonding packaging is improved, and the percent of pass of products is high.

Description

technical field [0001] A die-bonding pick-up and packaging device belongs to the technical field of chip packaging devices. Background technique [0002] LED packaging technology is a precision assembly and manufacturing technology that bonds, fixes, seals and protects chips. LED packaging equipment includes cleaning, solid crystal, solid crystal baking, wire bonding, phosphor spotting, lens installation, lens potting, and test packaging. A set of production processes, the core of which is the solid crystal and soldering process. Before encapsulating the LED, the chip must first be separated from the blue film and transferred to the lead frame to realize the encapsulation of the chip. When packaging the chip, it is necessary to determine the posture of the chip to ensure the accuracy of the chip packaging. Since the mold holding the blue film is ring-shaped, it is difficult to adjust the posture of the chip, which makes it difficult to adjust the posture of the chip and aff...

AI Technical Summary

Problems solved by technology

When packaging the chip, it is necessary to determine the posture of the chip to ensure the accuracy of the chip packaging. Since the mold holding the blue film is ring-shaped, it is difficult to adjust the posture of the chip, which makes it difficult to adjust the posture of the chip and affects the accuracy of the chip packaging.

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