High-temperature-resistant photosensitive label and processing method thereof

Abstract

The invention relates to a high-temperature-resistant photosensitive label and a processing method thereof, a resin layer is designed, the problem that photosensitive powder fades due to the existenceof acidified substances is avoided, and compared with a traditional rubber adhesive, an epoxy resin adhesive is added, so that the high-temperature-resistant photosensitive label is better in high temperature resistance, thicker in colloid and not prone to falling off.

Description

technical field

[0001] The invention relates to the field of label processing, in particular to a high temperature resistant photosensitive label and a processing method thereof. Background technique

[0002] Labels are mostly used for product packaging and annotation labels for various equipment. For some annotations that require obvious attention, photosensitive labels are often required. This photosensitive label can emit light in a dark environment, but the high temperature resistance of photosensitive labels in the existing market is relatively low. Poor. On the one hand, the adhesive layer is easy to fall off under high temperature environment. On the other hand, the photosensitive powder needs to be added with photosensitive acid compound, which is easy to fade under high temperature. Therefore, the above two problems must be solved in order to realize the functions of high temperature resistance and light sensitivity at the same time. Contents of the invention [0...