Ceramic packaging shell and electroplating method convenient for electroplating
A technology of ceramic packaging and casing, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of low yield of packaging and casing, complicated wire binding operation, poor reliability, etc., achieve high cost performance, avoid cumbersome operations, and simple processing Effect
Active Publication Date: 2021-06-15
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology
[0003] The purpose of the present invention is to provide a ceramic packaging shell that is convenient for electroplating, aiming to solve the problems of low yield and poor reliability of the packaging shell caused by complicated wire binding operations, electrode virtual connections in the wire binding, and no plating at the wire binding position.
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[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0026] Please also refer to Figure 1 to Figure 4 Now, the ceramic packaging shell that is convenient for electroplating provided by the present invention will be described. The ceramic packaging shell that is convenient for electroplating includes a ceramic part 4 and a metal wall 5 disposed on the ceramic part 4, a heat sink 3 is provided at the bottom of the ceramic part 4, and a heat sink 3 is provided on the upper surface of the ceramic part 4. There are a first electrode 1 and a second electrode 2, the metal wall 5, the heat sink 3, the first electrode 1 and...
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The invention provides a ceramic packaging shell and an electroplating method that are convenient for electroplating, which belong to the technical field of ceramic packaging, and include a ceramic part and a metal wall on the ceramic part. The bottom of the ceramic part is provided with a heat sink. The upper surface of the ceramic part is provided with a first electrode and a second electrode, and the metal wall, the heat sink, the first electrode and the second electrode are insulated from each other by the ceramic part, The upper surface of the ceramic part is provided with four metallization areas, and the four metallization areas are insulated from each other by the ceramic part, and each metallization area is respectively connected by a conductive structure provided inside the ceramic part. The metal wall, the heat sink, the first electrode and the second electrode are connected in one-to-one correspondence. The ceramic packaging shell that is convenient for electroplating provided by the present invention can solve the problems of low yield and poor reliability of the packaging shell caused by complicated wire binding operations, electrode virtual connections in the wire binding, and no plating at the wire binding position.
Description
technical field [0001] The invention belongs to the technical field of ceramic packaging, and more specifically relates to a ceramic packaging shell which is convenient for electroplating and an electroplating method. Background technique [0002] A typical structure of a ceramic case used to package a power transistor is as Figure 5 shown. This type of structure is mainly used to package MOS power transistors, power Schottky rectifiers, voltage regulators, etc. It is a commonly used power transistor packaging form. Its structure includes metal walls, ceramic parts, first electrodes, second electrodes and Heat sink. Among them, the metal wall, electrode 1, electrode 2, and heat sink are insulated two by two. During electroplating, the four parts need to be connected by binding copper wires. The shortcomings of the current connection method of binding copper wires are as follows: (1) When binding copper wires, it is necessary to wind the ceramic shell several times to ensu...
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IPC IPC(8): H01L23/04H01L21/48C25D5/54
CPCC25D5/54H01L21/4807H01L23/04
Inventor 李明磊刘林杰高岭乔志壮
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP