LED lamp bead preparation method
A technology of LED lamp beads and LED chips, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as diaphragm deviation, achieve the effect of improving central illuminance, improving uniformity, and avoiding diaphragm position deviation
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[0025] Such as figure 1 Shown is a schematic flow chart of an embodiment of the LED lamp bead preparation method provided by the present invention. It can be seen from the figure that the preparation method includes:
[0026] S1 coating a phosphor layer with a preset thickness on the surface of the support film and baking to obtain a phosphor film 5;
[0027] S2 pastes the fluorescent film 5 on the surface of the UV film;
[0028] S3 uniformly arrange the flip-chip LED chips 2 on the surface of the fluorescent film 5;
[0029] S4 put the silica gel 3 between the LED chips 2 and solidify;
[0030] S5 cuts the silica gel 3 between the LED chips 2 to obtain a single LED chip 2 with a fluorescent film 5;
[0031] S6 fixes the LED chip 2 with the fluorescent film 5 on the surface of the support 1;
[0032] S7 flows the white glue 4 between the LED chips 2 and solidifies;
[0033] S8 cuts the white glue 4 between the bracket 1 and the LED chip 2 according to the requirements, a...
Embodiment 1
[0046] 1: According to a certain mass ratio (silica gel: yellow phosphor powder: red phosphor powder = 1:1.067:0.033), mix the phosphor powder with silica gel, and mix evenly with a defoaming machine, and evenly coat a layer of thickness 65 μm on the support film , baked at a temperature of 80°C for 30 minutes;
[0047] 2: Paste the fluorescent film on the high temperature resistant UV film;
[0048] 3: Fix and bond the flip-chip LED chips (28mil in size) on the fluorescent film at equal distances, the distance between the LED chips is 50μm; then put the silica gel in the space between the LED chips, put the fluorescent film and the Silicone curing;
[0049] 4: According to the center position between the LED chips (that is, at a distance of 25 μm from the LED chip), use a blade to cut into individual LED chips with fluorescent film;
[0050] 5: Flip the cut LED chips onto the blue film and spread them out for easy crystal bonding.
[0051] 6: Fix the LED chip with fluoresc...
Embodiment 2
[0056] 1: Mix phosphor powder with silica gel according to a certain mass ratio (silica gel: yellow phosphor = 1:1.2), and mix evenly with a defoaming machine, then evenly coat a layer of 55 μm in thickness on the support film, and heat it at a temperature of 80°C Bake for 30 minutes;
[0057] 2: Paste the fluorescent film on the high temperature resistant UV film;
[0058] 3: Fix the LED chips (57mil in size) on the fluorescent film at equal distances, and the distance between the LED chips is 200μm; then put the silica gel in the space between the LED chips, and put the fluorescent film and silica gel into the oven to cure;
[0059] 4: According to the center position between the LED chips (that is, 100 μm away from the LED chip), use a blade to cut into a single LED chip with a fluorescent film;
[0060]5: Flip the cut LED chips onto the blue film and spread them out for easy crystal bonding.
[0061] 6: Fix the LED chip with fluorescent film on the ceramic bottom plate, ...
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