Integrated circuit packaging structure

Abstract

The invention discloses an integrated circuit packaging structure. The integrated circuit packaging structure comprises a mounting plate and a circuit board, the circuit board is arranged at the top of the mounting plate, a chip is arranged at the top of the circuit board, a lead is arranged in the chip, the two ends of the lead are distributed on the two sides of the chip, a packaging box is arranged at the top of the mounting plate, telescopic rods are welded to the two sides of the interior of the packaging box, the telescopic rods are sleeved with buffer springs, buffer plates are welded to the ends of the telescopic rods and the ends of the buffer springs, and a damp-proof layer is welded in the packaging box. According to the invention, the buffer plate and the buffer spring are arranged; and, in the moving transportation process, the buffer plate telescopic rod and the buffer spring are pressed to move towards one side, and the telescopic rod and the buffer spring can effectively reduce the shaking of the integrated circuit board when the integrated circuit board is shaken, thereby preventing the damage of internal elements of the packaging box, reducing the economic loss, reducing the internal temperature of the packaging box, and preventing the internal elements of the packaging box from being burnt out due to the overhigh temperature.

Description

technical field [0001] The invention relates to the technical field of integrated circuit equipment, in particular to an integrated circuit packaging structure. Background technique [0002] Integrated circuit packaging is advancing along with the development of integrated circuits. With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the whole machine is also changing towards multi-function and miniaturization. In this way, integrated circuits are required The integration level is getting higher and higher, and the functions are more and more complex. The integrated circuit package must also fully adapt to the needs and development of the electronic machine. Due to the different functions of various electronic equipment and instruments, their overall structure and assembly requirements are often Therefore, integrated circuit packages must be varied to meet the needs of various complete machines....

AI Technical Summary

Problems solved by technology

[0003] In the process of moving and transporting the existing integrated circuit packaging structure, the shaking of the integrated circuit board will affect the damage of internal components, causing unnecessary economic losses. During the operation and use of the integrated circuit, its heat accumulation will appear The internal component temperature is too high and burned, the installation of the integrated circuit is not stable enough, the internal components are damaged, and the accumulation of moisture makes the integrated circuit unable to be used effectively. Therefore, it is urgent to design an integrated circuit packaging structure to solve the above problems

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