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Shielded semiconductor device and lead frame therefor

A technology of lead frame and lead, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as harmful devices and increasing the overall size of the package

Inactive Publication Date: 2020-05-08
NXP USA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, using a conductive metal shroud increases the overall size of the package and requires an additional soldering step to attach the metal shroud to the device, and the heat generated by this extra soldering process can jeopardize the device

Method used

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  • Shielded semiconductor device and lead frame therefor
  • Shielded semiconductor device and lead frame therefor
  • Shielded semiconductor device and lead frame therefor

Examples

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Embodiment Construction

[0044] Detailed illustrative embodiments of the invention are disclosed herein. However, specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments of the present invention. The invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention.

[0045]As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the terms "comprises, comprising, includes and / or including" specify the presence of stated features, steps or components, but do not exclude the presence or addition of one or more other features, steps or components. It should also be noted that...

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PUM

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Abstract

A shielded semiconductor device is assembled using a lead frame having a die receiving area, leads disposed around the die receiving area, and a bendable strip formed in the die receiving area. Each lead has an inner lead end that is spaced from but near to one of the sides of the die receiving area and an outer lead end that is distal to that side of the die receiving area. An IC die is attachedto the die receiving area and electrically connected to the inner lead ends of the leads. An encapsulant is formed over the die and the electrical connections and forms a body. The strip is bent to extend vertically to a top side of the body. A lid is formed on the top side of the body and is in contact with a distal end of the vertical strip.

Description

technical field [0001] The present invention relates generally to semiconductor devices and semiconductor device packages, and more particularly, to semiconductor device packages with electromagnetic interference protection. Background technique [0002] Semiconductor device packages or integrated circuit chip carriers are used in a number of high density electronic device applications. Protect integrated circuits or semiconductor devices from the external environment by encapsulating them with epoxy materials or by transfer molding thermoplastic resins around them. However, as circuits become smaller, denser, and operate at higher frequencies and in harsher environments, there is an increasing need to protect circuits from radiation such as radio frequency interference (RFI) and electromagnetic interference (electromagnetic interference, EMI). For example, cellular telephones and other mobile devices need to be protected from such radiation. There is also a need to prote...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/31
CPCH01L23/49541H01L23/49524H01L23/3107H01L2224/32145H01L2224/48145H01L2224/48247H01L2224/73265H01L2224/32245H01L2224/48091H01L2224/97H01L2924/3025H01L23/49551B81B7/0064H01L23/49582H01L21/561H01L23/552B81B7/0061B81B2201/0264G01L9/0042H01L2924/00012H01L2924/00014H01L2224/85H01L2224/83H01L2924/00B81B7/007B81B2207/012B81B2207/098B81C1/00301B81C1/00309B81C2203/0154B81C2203/0792
Inventor 阮丽霏傅梓淞迈克尔·B·文森特
Owner NXP USA INC
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