Photoelectric detector

A photodetector and light-splitting technology, applied in the field of photodetectors, can solve problems such as incompatibility with silicon technology, obvious saturated absorption effect, and low responsivity

Active Publication Date: 2020-05-08
WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
View PDF8 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the energy band structure of crystalline silicon materials determines that its detection efficiency in the optical communication band is very low. Although III-V semiconductor materials are more suitable for photodetectors, III-V semiconductor materials are not compatible with silicon technology and cannot be used with silicon Carry out effective monolithic integration; Co

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photoelectric detector
  • Photoelectric detector
  • Photoelectric detector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided for a more thorough understanding of the present application and for fully conveying the scope disclosed in the present application to those skilled in the art.

[0029] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features kno...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiment of the invention discloses a photoelectric detector, and the photoelectric detector comprises a silicon layer which comprises a doped region of a first doping type; a germanium layer incontact with the silicon layer, wherein the germanium layer comprises a doped region of a second doping type; a first layer of waveguide, wherein the first layer of waveguide comprises a first detection coupling region arranged above the germanium layer; a second layer of waveguide which comprises a second detection coupling region arranged on the side surface of the germanium layer, wherein thefirst layer of waveguide and the second layer of waveguide are used for transmitting optical signals, and the first layer of waveguide and the second layer of waveguide are used for coupling the optical signals to the germanium layer through the first detection coupling region and the second detection coupling region respectively, and the germanium layer is used for detecting the optical signal and converting the optical signal into an electric signal.

Description

technical field [0001] The embodiments of the present application relate to the technical field of photodetectors, and in particular to a photodetector. Background technique [0002] Silicon photonics technology is a new generation of optical device development and integration based on silicon and silicon-based substrate materials (such as SiGe / Si, silicon-on-insulator, etc.) using existing complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) technology technology. Silicon photonics technology combines the characteristics of ultra-large-scale and ultra-high-precision manufacturing of integrated circuit technology with the advantages of ultra-high speed and ultra-low power consumption of photonic technology. It is a disruptive technology to cope with the failure of Moore's Law. This combination benefits from the scalability of semiconductor wafer fabrication, thereby reducing costs. As one of the core devices of silicon photonics architect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L31/109H01L31/0232
CPCH01L31/0232H01L31/109
Inventor 胡晓肖希王磊陈代高张宇光李淼峰
Owner WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products