Lead frame and supporting and positioning device for lead frame stacking

Abstract

The invention discloses a lead frame and a supporting and positioning device for lead frame stacking. The lead frame comprises a frame body and islands, wherein supporting blocks are inserted into theouter side of the frame body; the supporting blocks are copper-aluminum alloy heat conduction blocks; each supporting block is provided with an inserting groove at the inserting position of the framebody; a fixed block and a movable block are arranged on the two sides between a bottom plate and a top plate; block grooves matched with the supporting blocks are formed in the opposite sides of thefixed block and the movable block up and down at equal intervals; a lower supporting block and an upper supporting block are fixedly arranged on the two sides of the bottom plate and the two sides ofthe top plate respectively; universal wheels are installed on the lower supporting block and the upper supporting block on the side of the fixed block; a sleeve with an opening in one side is fixedlyarranged at the bottom of the bottom plate; and a pull rod is installed in the sleeve in a sliding mode. According to the invention, a protective structure can be provided for the edge of the frame body, the heat dissipation effect of the whole frame structure is improved, internal elements cannot be extruded and damaged, a draw-bar box structure can be formed after stacking, and the moving and carrying are convenient.

Description

technical field [0001] The invention belongs to the technical field of waste treatment, in particular to a lead frame, and also relates to a support and positioning device for stacking lead frames. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. Copper alloys for lead frames are roughly divided into copper-iron series, copper-nickel- Silicon, copper-chromium, copper-nickel-tin (JK--2 alloy), etc., ternary, quaternary and other multi-component copper alloys can achieve better performance and l...

AI Technical Summary

Problems solved by technology

[0003] Because the existing lead frame structure has no protective structure on the edge, the edge of the frame is easily damaged, and the heat dissipation effect of the lead frame structure is poor. When the lead frame is stacked, when the existing support is positioned, the frame is easily squeezed when stacked. Cause damage to components, and it is inconvenient to carry and move after stacking

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