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A Method for Epitaxial Growth of High Quality and Large Size Single Crystal Diamond

A single crystal diamond, epitaxial growth technology, applied in the direction of single crystal growth, single crystal growth, crystal growth, etc., can solve the problem of diamond layer adhesion and so on

Active Publication Date: 2021-02-12
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the adhesion problem of the diamond layer caused by the large difference in thermal expansion coefficient is an important difficulty
However, due to the large lattice mismatch problem between the transition layer and iridium, the deposition growth and dislocation density control of the metal iridium layer have also become important problems in single crystal diamond epitaxy (Comprehensive Hard Materials, 3, 269-304, ( 2014))

Method used

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  • A Method for Epitaxial Growth of High Quality and Large Size Single Crystal Diamond

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Experimental program
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Effect test

Embodiment 1

[0054] (1) Deposit a thin layer of metallic nickel by electron beam evaporation at a speed of 0.01nm / s under the condition of heating at 100°C on the ultra-flat mosaic single crystal diamond sheet after precision polishing and acid boiling cleaning pretreatment; (2) After the thickness of nickel thin layer deposition reaches 100nm, metal iridium is deposited at the same temperature, and metal iridium is deposited at a speed of 0.01nm / s to a thickness of 15nm at the initial stage of deposition; (3) after the initial stage of metal iridium deposition, increase the substrate heating Temperature to 700°C, continue to deposit metal iridium at a rate of 0.5nm / s to a thickness of 150nm; (4) Use a microwave plasma chemical vapor deposition system to control the input power to 1.5kW and the chamber pressure to 10kPa under the condition of pure hydrogen gas , the temperature is 700 ℃ to clean the surface of iridium for 10min, and then the methane with the flow rate of hydrogen is 10:100 ...

Embodiment 2

[0056] (1) Deposit a thin layer of metallic nickel by electron beam evaporation at a speed of 0.02nm / s under the condition of heating at 200°C on the ultra-flat mosaic single crystal diamond sheet after precision polishing and acid boiling cleaning pretreatment; (2) After the thickness of nickel thin layer deposition reaches 150nm, metal iridium is deposited at the same temperature, and metal iridium is deposited at a speed of 0.01nm / s to a thickness of 20nm in the initial stage of deposition; (3) after the initial stage of metal iridium deposition, increase the substrate heating Temperature to 800°C, continue to deposit metal iridium at a rate of 0.5nm / s to a thickness of 150nm; (4) Use a microwave plasma chemical vapor deposition system to control the input power to 1.5kW and the cavity pressure to 10kPa under the condition of pure hydrogen gas , the temperature is 700 ℃ to clean the surface of iridium for 20min, and then the methane with the hydrogen flow ratio of 12:100 is ...

Embodiment 3

[0058] (1) Deposit a thin layer of metallic nickel by electron beam evaporation at a speed of 0.03nm / s under the condition of heating at 300°C on the ultra-flat mosaic single crystal diamond sheet after precision polishing and acid boiling cleaning pretreatment; (2) After the thickness of nickel thin layer deposition reaches 150nm, metal iridium is deposited at the same temperature, and metal iridium is deposited at a speed of 0.01nm / s in the initial stage of deposition until the thickness reaches 30nm; (3) after the initial stage of metal iridium deposition, increase the substrate heating Temperature to 900°C, continue to deposit metal iridium at a rate of 0.5nm / s to a thickness of 200nm; (4) Use a microwave plasma chemical vapor deposition system to control the input power to 1.5kW and the cavity pressure to 10kPa under the condition of pure hydrogen gas , the temperature is 700 DEG C to clean the surface of iridium for 30min, and then feed methane with a flow ratio of 15:100...

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Abstract

A method for epitaxial growth of high-quality and large-size single crystal diamond belongs to the field of semiconductor material preparation. The method is to reduce the surface roughness to less than 0.2nm by precision polishing the large-size single crystal diamond sheet grown by mosaic splicing. Then use electron beam evaporation to deposit metal nickel with a thickness of 100nm-200nm on the surface at a rate of 0.01nm / s-0.1nm / s while heating the substrate at 100-500°C, and then deposit nickel at a rate of 0.01nm / s-0.5nm / s. The speed of s deposits metallic iridium. After the iridium thickness reaches 15nm-40nm, increase the heating temperature of the substrate to 700-1000°C and accelerate the deposition rate to 0.5nm / s-1nm / s, and finally deposit a thin layer of iridium with a total thickness of 150nm-300nm. Then, the plasma chemical vapor deposition technology is used to pre-deposit a 4-10nm amorphous carbon layer after hydrogen plasma cleaning the iridium surface to promote the enrichment of carbon atoms on the subsurface of the iridium thin layer. Finally, after etching the substrate with pure hydrogen plasma for 6-15s, the negative bias voltage and methane flux were adjusted to realize the biased in-situ nucleation of large-sized single crystal diamond on the iridium surface and the subsequent unbiased epitaxial growth.

Description

Technical field: [0001] The invention relates to the field of preparation of matrix materials for semiconductors. In particular, the preparation of high-quality large-size single crystal diamond provides a material preparation basis for the further realization of diamond-based semiconductor devices. That is, by depositing a metal nickel transition layer and a thin iridium layer on a high-gloss large-scale mosaic splicing single-crystal diamond self-supporting substrate. And the chemical vapor deposition method is used to pre-deposit an amorphous carbon thin layer on the surface of metal iridium, followed by pure hydrogen etching, and finally adjust the methane flux to realize the single-oriented crystallization of the iridium thin layer and the in-situ nucleation and growth of diamond, which is highly efficient. High-quality and large-size single crystal diamond can be obtained by heteroepitaxial method. [0002] technical background [0003] Diamond has extremely excellent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/04C30B25/18
CPCC30B25/183C30B29/04
Inventor 李成明郑宇亭邵思武朱肖华刘金龙魏俊俊陈良贤
Owner UNIV OF SCI & TECH BEIJING
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