Heat dissipation device and communication product

Abstract

The invention provides a heat dissipation device and a communication product. The heat dissipation device comprises a temperature equalization unit; the temperature equalization unit comprises a firsttemperature equalization plate, a second temperature equalization plate and a connecting plate for connecting the first temperature equalization plate and the second temperature equalization plate; the first temperature equalization plate and the second temperature equalization plate are each provided with a pipeline; each pipeline is provided with a vacuum sealing cavity; phase change working media are injected into the vacuum sealing cavities; a first bent part is arranged at the end, away from the connecting plate, of the first temperature equalization plate; and a second bent part is arranged at the end, away from the connecting plate, of the second temperature equalization plate. The temperature equalizing plates are arranged to be n-shaped, so that the heat contact area of the GreatWall type phase change temperature equalization plates and a base is greatly increased; the embedded tooth bosses of a heat dissipation base are reduced; heat transfer contact heat resistance is reduced; heat dissipation performance is improved; the weight of the heat dissipation device is reduced; the temperature difference of the heat dissipation device is reduced through a common-cavity pipeline mode; and the overall temperature equalization of the device is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation device and communication products. Background technique [0002] The heat pipe is a highly efficient heat transfer element with high heat transfer efficiency and heat flux. At present, tubular micro-heat pipes have been widely used in equipment thermal management systems, but they have limitations in heat transfer area and structure based on one-dimensional heat transfer. The phase change vapor chamber makes the phase change process of the working liquid a two-dimensional or even three-dimensional heat transfer, and the heat source can also be in direct contact with the heat pipe, which can strongly control the temperature of the discrete local heat source hot zone. The phase change vapor chamber is a plate structure with a hollow cavity, which is composed of a shell, pipes inside the shell and a phase change working medium. The cavity is fill...

AI Technical Summary

Problems solved by technology

The edge of the phase-change vapor chamber of the existing cog technology is embedded in the groove of the heat dissipation base through the interference fit of the cog technology. This process has the following defects: the thermal contact area between the teeth and the heat dissipation base is small, and the contact thermal resistance is large, which is not conducive to cooling

The cog technology needs to make protrusions on the groove structure of the heat dissipation base, which is not conducive to weight reduction

The interference fit process of the cog is difficult to control, the process of the cog is poor in manufacturability, the production efficiency is low, and the assembly accuracy cannot be effectively guaranteed

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