Double-gantry type structure slice cutting machine symmetrical about YZ plane

Abstract

The invention relates to a double-gantry type structure slice cutting machine symmetrical about a YZ plane. The double-gantry type structure slice cutting machine comprises a base, the base is provided with an X-axis linear motion module along the X axis, the X-axis linear motion module is provided with an Rz-axis rotation module, the part, on the two sides of the X-axis linear motion module, of the base is parallelly provided with two gantries at intervals in the X-axis direction, the top of the position between the two gantries is provided with a Y-axis linear motion module along the Y axis,the Y-axis linear motion module is provided with a Z-axis linear motion module along the Z axis, the bottom of the Z-axis linear motion module is provided with a main shaft module located above the Rz-axis rotation module, and the two gantries, the Y-axis linear motion module, the Z-axis linear motion module and the main shaft module are integrally symmetrical about the YZ plane. Compared with single-gantry structures in the prior art, by means of the double-gantry type structure slice cutting machine symmetrical about the YZ plane, influence of heat, self weight, motion inertia force, vibration and other factors can be reduced, and the machining precision of the slice cutting machine is improved.

Description

technical field [0001] The invention relates to the technical field of gantry type dicing machine devices, in particular to a double gantry structure dicing machine symmetrical about the YZ plane. Background technique [0002] Grinding wheel dicing machine is a precision CNC processing equipment that uses a high-speed rotating extremely thin grinding wheel blade to cut and divide sheet or block materials. The processing objects are very wide, such as silicon wafers, semiconductor compound wafers, oxide wafers, chip LED substrates, semiconductor packaging substrates, electronic components, optical components, ceramics, glass, crystal, sapphire, composite materials, etc. Many applications, such as the cutting of silicon wafers, put forward extremely high precision requirements for the grinding wheel dicing machine, for example, the positioning accuracy is required to be 2 microns in the available stroke of 300 mm. The accuracy requirement of this level has basically approache...

AI Technical Summary

Problems solved by technology

However, the existing gantry structure has only one gantry frame, and a pair of linear guide rails on the Y axis are installed sideways on the front of the gantry beam. Deformation that deviates from the plane of symmetry

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