Portable computer heat dissipation module and computer heat dissipation device

A portable computer and heat dissipation module technology, which is applied in computing, instruments, electrical digital data processing, etc., can solve the problems of small heat dissipation range, computer hardware influence, and unsatisfactory heat dissipation effect, so as to ensure uniformity and improve heat dissipation effect , Ease of maintenance

Inactive Publication Date: 2020-06-05
ZHEJIANG GUANGSHA COLLEGE OF APPLIED CONSTRTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned prior art, the structure for dissipating heat from the computer is too single, and its heat dissipation effect is often unsatisfactory. In actual use, t

Method used

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  • Portable computer heat dissipation module and computer heat dissipation device
  • Portable computer heat dissipation module and computer heat dissipation device
  • Portable computer heat dissipation module and computer heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Such as Figure 1-3 As shown, in the embodiment provided by the present invention, a heat dissipation module for a portable computer includes a heat dissipation module 10, and the heat dissipation module 10 includes

[0045] A base 101, the base 101 has a heat dissipation chamber 104, one side of the heat dissipation chamber 104 has a circular step hole 103, and the other side of the heat dissipation chamber 104 has a rectangular installation groove 113;

[0046] An air pump 105, the air pump 105 blows air into the cooling cavity 104 through the air intake pipe 106;

[0047] A cooling plate 109, a plurality of through holes are evenly distributed on the cooling plate 109, and the cooling plate 109 located in the outermost layer is facing the air outlet of the air intake pipe 106; and

[0048] The heat sink 110, at least two groups of the heat sink 109 are evenly installed on the heat sink 110, the heat sink 110 is fixedly installed in the rectangular installation groov...

Embodiment 2

[0057] Such as Figure 1-3 As shown, in the embodiment provided by the present invention, a heat dissipation module for a portable computer includes a heat dissipation module 10, and the heat dissipation module 10 includes

[0058] A base 101, the base 101 has a heat dissipation chamber 104, one side of the heat dissipation chamber 104 has a circular step hole 103, and the other side of the heat dissipation chamber 104 has a rectangular installation groove 113;

[0059] An air pump 105, the air pump 105 blows air into the cooling cavity 104 through the air intake pipe 106;

[0060] A cooling plate 109, a plurality of through holes are evenly distributed on the cooling plate 109, and the cooling plate 109 located in the outermost layer is facing the air outlet of the air intake pipe 106; and

[0061] The heat sink 110, at least two groups of the heat sink 109 are evenly installed on the heat sink 110, the heat sink 110 is fixedly installed in the rectangular installation groov...

Embodiment 3

[0073] Such as Figure 1-3 As shown, in the embodiment provided by the present invention, a heat dissipation module for a portable computer includes a heat dissipation module 10, and the heat dissipation module 10 includes

[0074] A base 101, the base 101 has a heat dissipation chamber 104, one side of the heat dissipation chamber 104 has a circular step hole 103, and the other side of the heat dissipation chamber 104 has a rectangular installation groove 113;

[0075] An air pump 105, the air pump 105 blows air into the cooling cavity 104 through the air intake pipe 106;

[0076] A cooling plate 109, a plurality of through holes are evenly distributed on the cooling plate 109, and the cooling plate 109 located in the outermost layer is facing the air outlet of the air intake pipe 106; and

[0077] The heat sink 110, at least two groups of the heat sink 109 are evenly installed on the heat sink 110, the heat sink 110 is fixedly installed in the rectangular installation groov...

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Abstract

The embodiment of the invention relates to the field of computer equipment, and particularly discloses a portable computer heat dissipation module which comprises a heat dissipation module body. The heat dissipation module comprises a base, an air pump, heat dissipation plates and a heat dissipation base. At least two sets of heat dissipation plates are evenly distributed and installed on the heatdissipation base. The embodiment of the invention further provides a computer heat dissipation device, the computer heat dissipation device comprises the heat dissipation module, a shell, a box doorand an air blowing mechanism, and the air blowing mechanism directly faces computer hardware on the heat dissipation module. According to the heat dissipation module provided by the embodiment of theinvention, heat generated in the running process of computer hardware can be dissipated in time, so that the computer hardware is prevented from being damaged due to overheating. According to the computer heat dissipation device provided by the embodiment of the invention, the air blowing mechanism is used for uniformly blowing air to the computer hardware on the heat dissipation module in the front direction, so that the heat dissipation effect of the surface of the computer hardware in the operation process is accelerated.

Description

technical field [0001] The invention relates to the field of computer equipment, in particular to a portable computer cooling module and a computer cooling device. Background technique [0002] A computer is an electronic computing machine used for high-speed calculations. It can perform numerical calculations and logic calculations. It also has storage and memory functions. It is a modern intelligent electronic device that can run according to programs and automatically and high-speed process massive data. Existing A computer is composed of a variety of electronic components. When using an electronic computer to work, a large amount of heat is usually generated. If the heat accumulation cannot be discharged in time, it will easily lead to a high temperature inside the chassis and affect the service life of various electronic components. [0003] For example, the prior art (publication number: CN 209803721 U) discloses a heat dissipation structure with a shock-absorbing func...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20G06F1/203
Inventor 虞晓霞蔡金亚
Owner ZHEJIANG GUANGSHA COLLEGE OF APPLIED CONSTRTECH
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