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Plated through hole machining method for improving reliability of 5G high-frequency material

A technology of high-frequency materials and processing methods, applied in high-frequency matchers, the formation of electrical connection of printed components, printed circuits, etc., can solve problems such as hole copper fracture, achieve excellent electrical connection performance, delay shedding, and prolong the cleaning cycle of anodes Effect

Inactive Publication Date: 2020-06-05
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a method for processing plated through holes of 5G high-frequency materials to improve reliability. Expansion and shrinkage lead to reliability problems of hole copper fracture

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A plating through-hole processing method for improving reliability of 5G high-frequency materials, characterized in that it comprises the following steps:

[0032] S1. After drilling and electroplating to form a metallized through hole, fill the hole with resin / copper paste;

[0033] S2. After the resin is cured, use a drill bit 0.3mm smaller than the original diameter to perform secondary drilling to form a drill hole in the filled resin;

[0034] S3. After the second drilling, through-hole plating is performed, and the copper plating layer of the secondary hole is sandwiched with resin / copper paste, so that the resin / copper paste becomes a buffer for the copper plating layer of the secondary hole.

[0035] In the production process of the prior art, the expansion and contraction stress changes caused by the alternation of cold and heat lead to the opening of the via hole after the deformation of the copper in the hole due to fatigue and fracture. In the present inven...

Embodiment 2

[0050] A plating through-hole processing method for improving reliability of 5G high-frequency materials, characterized in that it comprises the following steps:

[0051] S1. After drilling and electroplating to form a metallized through hole, fill the hole with resin / copper paste;

[0052] S2. After the resin is cured, use a drill bit 0.2mm smaller than the original diameter to perform secondary drilling to form a drill hole in the filled resin;

[0053] S3. After the second drilling, through-hole plating is performed, and the copper plating layer of the secondary hole is sandwiched with resin / copper paste, so that the resin / copper paste becomes a buffer for the copper plating layer of the secondary hole.

[0054] In the production process of the prior art, the expansion and contraction stress changes caused by the alternation of cold and heat lead to the opening of the via hole after the deformation of the copper in the hole due to fatigue and fracture. In the present inventi...

Embodiment 3

[0069] A plating through-hole processing method for improving reliability of 5G high-frequency materials, characterized in that it comprises the following steps:

[0070] S1. After drilling and electroplating to form a metallized through hole, fill the hole with resin / copper paste;

[0071] S2. After the resin is cured, use a drill bit 0.4mm smaller than the original diameter to perform secondary drilling to form a drill hole in the filled resin;

[0072] S3. After the second drilling, through-hole plating is performed, and the copper plating layer of the secondary hole is sandwiched with resin / copper paste, so that the resin / copper paste becomes a buffer for the copper plating layer of the secondary hole.

[0073] In the production process of the prior art, the expansion and contraction stress changes caused by the alternation of cold and heat lead to the opening of the via hole after the deformation of the copper in the hole due to fatigue and fracture. In the present inven...

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Abstract

The invention provides a plated through hole processing method for improving reliability of a 5G high-frequency material, which comprises the following steps of: S1, drilling, electroplating to form ametallized through hole, and filling resin / copper paste into the hole; S2, after the resin is cured, using a drill bit with the diameter smaller than the original diameter by 0.2-0.4 mm for secondarydrilling to form a drill hole in the filled resin; and S3, carrying out through hole electroplating after secondary drilling, enabling a secondary hole copper electroplating layer to wrap and clamp the resin / copper paste, so that the resin / copper paste becomes the buffer of the secondary hole copper plating layer. According to the invention, after the primary hole copper is broken, the secondaryhole copper can also ensure via hole interconnection, and due to the gap between the primary hole copper and the hole plugging resin, the stress cannot act on the secondary hole copper, and the reliability of via hole connection is ensured.

Description

technical field [0001] The invention belongs to the field of PCB processing methods, and in particular relates to a method for processing through-plated holes of 5G high-frequency materials to improve reliability. Background technique [0002] Currently on the market for the production of PTFE sheets for PCB, when the dielectric constant of the sheet needs to be below 2.5, ceramic powder fillers cannot be added (because the addition of ceramic powder fillers will cause the dielectric constant to increase), causing its Z-axis The CTE cannot be effectively controlled. The measured Z-CTE of this type of sheet is often above 200ppm / °C, while the CTE of copper is 17ppm / °C. When testing its reliability in cold and hot cycles, the Z-CTE of -40°C~125°C is about one or two Within a hundred cycles the plated through-hole copper fractures began to occur due to material expansion and contraction. [0003] The cold and hot cycle actually verifies the long-term reliability of the PCB i...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/42H05K1/02H05K1/11
CPCH05K1/0237H05K1/115H05K3/0094H05K3/426H05K2201/0959
Inventor 苏南兵唐政和邱小华杨颖颖胡玉春
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD