Crystal bar slicing method

Abstract

The invention provides a crystal bar slicing method. The method comprises that: (S1) a crystal bar is at least partially dipped in an electrolytic tank including an electrolyte, wherein a cathode including a linear electrode is arranged in the electrolytic tank; (S2) relative positions between the crystal bar and the cathode are adjusted, so that the axial direction of the crystal bar is intersected with the length direction of the linear electrode, and the crystal bar is not contacted with the linear electrode; and (S3) when a power supply is communicated between the crystal bar and the cathode, the crystal bar and the linear electrode on the cathode perform a relative motion, wherein the power supply comprises a direct-current power supply, the crystal bar communicates with the positivepole of the direct-current power supply, and the cathode communicates with the negative pole of the direct-current power supply; and slicing of the crystal bar is implemented through the relative motion. According to the crystal bar slicing method, the section loss is effectively reduced, and meanwhile, the mechanism loss, wafer warpup and pollution caused by contact cutting are effectively prevented.

Description

Technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for slicing an ingot. Background technique [0002] At present, the cutting of ingots is dominated by mechanical wire cutting in which steel wire drives slurry. The principle is to use a high-speed moving steel wire to drive the cutting blade material attached to the steel wire to rub the silicon rod to achieve the cutting effect. [0003] Since steel wire is used in the wire cutting process, it is easy to introduce contaminants such as Cu and Fe. At the same time, the wire cutting process is used to cut the ingot, which cannot avoid the loss of section. In a typical cutting process, a cut-off loss of 200μm-250μm is often generated, resulting in a large amount of material waste and additional costs for recycling the raw materials. At the same time, in the in-line dicing process, a lot of heat is often generated, which in turn causes the parts to expand, which makes...

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