Method and device for cutting seed crystal for pseudo-single crystal

Abstract

The invention discloses a method and a device for cutting a seed crystal for a pseudo-single crystal, and by using the method and the device, the production cost is reduced. According to the method for cutting the seed crystal for the pseudo-single crystal, a metal wire is adopted to cut the seed crystal for the pseudo-single crystal, and the diameter of the metal wire is 0.1 to 0.3mm. The metal wire is adopted to cut the seed crystal for the pseudo-single crystal, and the diameter of the metal wire is 0.1mm to 0.3mm, so that the kerf lose of the seed crystal can be greatly reduced, namely, only 0.1mm to 0.3mm of the kerf lose is realized, and compared with the 3mm kerf lose of a diamond saw blade, the waste of the seed crystal is greatly reduced, the utilization ratio of the seed crystal is improved, and further the production cost of the pseudo-single crystal is greatly reduced; and moreover, the metal wire is used for cutting the seed crystal, the cut surface of the seed crystal is very smooth, subsequent process treatment of a cut surface is not required, and the seed crystal can be directly used, so that the production process steps are reduced, and the production cost is further reduced. The method and the device are suitable for popularization and application in the field of seed crystal cutting.

Description

technical field [0001] The invention relates to the field of seed crystal cutting, in particular to a method and a device for cutting a quasi-single crystal seed crystal. Background technique [0002] Quasi-single crystal is a process based on polycrystalline ingots. During crystal growth, a single crystal seed crystal is used in part to obtain polycrystalline silicon wafers that are similar in appearance and electrical properties to single crystals. This technology of forming monocrystalline silicon by ingot casting consumes only 5% more power than ordinary polycrystalline silicon, and the quality of monocrystalline silicon produced is close to that of Czochralski monocrystalline silicon. As we all know, in terms of the utilization rate of battery components, the silicon rod of Czochralski monocrystalline silicon is cylindrical, and the photovoltaic cells need to be cut off around, and the yield rate of the battery components is about 50%. Monocrystalline silicon ingots ar...

AI Technical Summary

Problems solved by technology

[0007] At present, diamond saw blades are mainly used for cutting seed crystals. Since the thickness of diamond saw blades is generally about 3 mm, if a 3 mm thick diamond saw blade is used to cut seed crystals, there will be a kerf loss of 3 mm, that is to say At least 3mm thick seed crystals will be wasted, the utilization rate of the seed crystals is low, and the seed crystals are expensive, and the low utilization rate of the seed crystals will greatly increase the production cost of quasi-single crystal silicon. Moreover, the use of diamond saw blades to cut the seed crystals , the cutting surface of the seed crystal is not smooth, and the cutting surface needs to be processed in a subsequent process, which is not only complicated in process but also high in cost

Images