A wire saw cutting method

A cutting method and sawing machine technology, applied in the field of solar cells, can solve the problems of high production cost of solar cells, high cost of silicon wafer cutting, large material loss, etc., to ensure the qualified rate of silicon wafer cutting and reduce the speed of the workbench Parameters, the effect of reducing the production cost

Active Publication Date: 2016-04-06
YINGLI GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of actually applying wire saw cutting technology to cut silicon wafers, the qualified rate of silicon wafers in the cost of cutting silicon wafers has been able to obtain a stable qualified rate of silicon wafers through strict operation control and continuous optimization of the cutting process. However, the output rate of raw silicon wafers in the cutting cost of silicon wafers can only reach 50%~55%, and the material loss is large, which makes the cutting cost of silicon wafers higher, resulting in higher production costs of solar cells.

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Embodiment 1

[0036] For the large wire saw steel wire of the existing wire saw cutting machine, the wire saw cutting method provided by the invention, such as figure 2 shown, including the following steps:

[0037] Step S101, reducing the steel wire diameter of the wire saw cutting machine.

[0038]The steel wire diameter of the large wire saw steel wire of the existing wire saw cutting machine is 0.13mm. In this embodiment, when reducing the steel wire diameter of the wire saw cutting machine, the steel wire diameter of the large wire saw steel wire with a diameter of 0.13mm is reduced to 0.125mm;

[0039] Step S102: Decrease the groove pitch of the guide wheel of the wire saw cutting machine.

[0040] Since silicon wafer thickness = guide wheel groove pitch - steel wire diameter - silicon carbide wear experience value, wherein the silicon carbide wear experience value is a constant value, generally 40 μm, so while reducing the steel wire diameter, in order to ensure the required silic...

Embodiment 2

[0057] For the medium-sized wire saw steel wire of the existing wire saw cutting machine, the wire saw cutting method provided by the present invention is different from the first embodiment in that the diameter of the steel wire is different, and the groove distance of the guide wheel of the wire saw cutting machine is different, correspondingly improving The wire speed parameter of the wire saw cutting machine, increase the slurry flow parameter of the wire saw cutting machine, reduce the steel wire tension parameter of the wire saw cutting machine, reduce the table speed parameter of the wire saw cutting machine, and reduce the In the process of slurry temperature parameters, the adjustment values ​​of various parameters are also different.

[0058] Step S101, reducing the steel wire diameter of the wire saw cutting machine.

[0059] The steel wire diameter of the medium-sized wire saw wire of the existing wire saw cutting machine is 0.12mm. The diameter is reduced to 0.11...

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Abstract

The invention provides a fretsaw cutting method, which comprises the following steps that the steel wire diameter of a fretsaw cutting machine is reduced; the guide wheel slot pitch of the fretsaw cutting machine is reduced; according to the steel wire diameter of the fretsaw cutting machine, the linear speed parameter of a steel wire of the fretsaw cutting machine is improved, the slurry flow rate parameter of the fretsaw cutting machine is improved, the steel wire tension parameter of the fretsaw cutting machine is reduced, the work stable speed parameter of the fretsaw cutting machine is reduced, and the slurry temperature parameter of the fretsaw cutting machine is reduced; and the fretsaw cutting is carried out. The fretsaw cutting technology provided by the invention has the advantages that the cutting qualified rate of silicon wafers is guaranteed, meanwhile, the saw kerf loss in the fretsaw cutting process is reduced, the output rate of raw material silicon wafers is improved, and further, the manufacture cost of solar cells is reduced.

Description

technical field [0001] The invention relates to the field of solar cells, in particular to a wire saw cutting method. Background technique [0002] In the current solar cell market, crystalline silicon solar cells are dominant, and the development trend is to reduce the production cost of solar cells. Considering that solar cells are produced based on silicon wafers, and silicon wafers are mainly obtained by cutting silicon blocks into thin slices, the cost of cutting silicon wafers is a part of the production cost of solar cells. The determinants of silicon wafer cutting cost include: silicon wafer cutting qualification rate and raw material silicon wafer output rate, where silicon wafer cutting qualification rate = the number of silicon wafers that meet the specifications per cutting / the number of silicon wafers produced per cutting; raw silicon Chip output rate = output silicon wafer weight / input silicon block quality. [0003] In the silicon wafer cutting process, ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B28D5/04
Inventor孟凡强张晓方高文宽
OwnerYINGLI GRP