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Packaging device of miniaturized high-performance reflective device

A packaging device, reflective technology, used in instruments, installations, optical components, etc., can solve problems such as poor long-term reliability, and achieve the effect of high long-term reliability

Pending Publication Date: 2020-06-16
SHANGHAI BRANCH FUZHOU GAOYI COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the MEMS of commonly used VOA devices is not hermetically packaged, and the MEMS chip is a component that is sensitive to water vapor, and the long-term reliability of not hermetically packaged is not good.

Method used

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  • Packaging device of miniaturized high-performance reflective device
  • Packaging device of miniaturized high-performance reflective device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1, such as figure 1 As shown, the lower part of the lens 3 is fixed on the hole wall of the through hole through the adhesive sleeve, and the length of the glue between the lens 3 and the TO cap 1 is as short as possible, which is enough to support the lens 3 . In order to effectively fix the lens 3, the thickness of the top wall of the TO cap 1 is relatively thick, preferably 0.5-1 mm.

[0017] The process of embodiment 1 is as follows: first step, first use glass welding to weld the window plate 4 on the TO cap 1, and then use electric current welding to weld the TO cap 1 to the TO base 2 equipped with the MEMS chip 5, The assembly thus formed has better airtightness; the second step is to glue a very short part of the lower part of the lens 3 to the through hole of the TO cap 1 .

Embodiment 2

[0018] Example 2, such as figure 2 As shown, the outer fixed sleeve of the lens 3 is provided with a glass tube 6, and the lower end surface of the glass tube 6 is fixedly connected to the top surface of the TO cap 1 by gluing. Such an embodiment can minimize the bonding area between the lens 3 and the glue, thereby effectively reducing the PDL brought by the glue and stress to the overall optical path.

[0019] The process of embodiment 2 is as follows: the first step is to use glass welding to weld the window 4 on the TO cap 1, and then weld the TO cap 1 to the TO base 2 equipped with the MEMS chip 5 by current welding, The assembly thus formed has better airtightness; in the second step, the lower end surface of the glass tube outside the lens 3 is glued to the top surface of the TO cap 1 .

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Abstract

The invention discloses a packaging device of a miniaturized high-performance reflective device. The packaging device comprises a TO tube cap, a TO base, a lens, a diaphragm and an MEMS chip. The TO base is provided with a PIN, the MEMS chip is connected to the TO base and is electrically connected with the PIN, the bottom of the TO pipe cap is connected with the TO base into a whole through current welding, a closed cavity is formed in the TO tube cap, and the MEMS chip is packaged in the closed cavity; a through hole is formed in the top wall of the TO tube cap, and the diaphragm is welded and fixed to the inner side of the top wall of the TO diaphragm cap through glass solder. And the lens is arranged by corresponding to the through hole and is fixedly connected with the top wall of theTO diaphragm cap through glue. With the adoption of the structure, the packaging structure of the MEMS chip adopts an airtight design, so that the long-term reliability is high; in addition, the bonding area of the lens and the glue is very small, so that the stress borne by the lens is very small, and the PDL brought to the whole light path by the stress is effectively reduced.

Description

technical field [0001] The invention relates to the field of optical communication devices, in particular to a packaging device for miniaturized high-performance reflective devices. Background technique [0002] At present, the MEMS of VOA devices commonly used is not hermetically packaged, and the MEMS chip is a component that is sensitive to water vapor, and the long-term reliability of not hermetically packaged is not good. Contents of the invention [0003] The object of the present invention is to provide a packaging device for miniaturized high-performance reflective devices with high long-term reliability and small PDL. [0004] To achieve the above object, the present invention adopts the following technical solutions: [0005] A packaging device for a miniaturized high-performance reflective device, including a TO tube cap, a TO base, a lens, a window and a MEMS chip. The TO base has a PIN pin, and the MEMS chip is connected to the TO base and connected to the TO...

Claims

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Application Information

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IPC IPC(8): G02B7/00G02B7/182G02B7/02
CPCG02B7/00G02B7/182G02B7/025
Inventor 赵武丽邓伟松李阳王宗源江梦春
Owner SHANGHAI BRANCH FUZHOU GAOYI COMM CO LTD