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A method of manufacturing a detachable light source substrate

A manufacturing method and disassembly technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of mass production and maintenance obstacles, increased manufacturing costs, and poor portability, so as to facilitate replacement and maintenance, improve utilization rate and Effect of portability and production cost reduction

Active Publication Date: 2021-07-13
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the control system of the power signal has the following problems: the LED is directly fixed on the substrate by means of conductive silver glue cold welding, resulting in the need to remake the substrate when replacing LEDs with different light wavelengths, which increases the production cost
[0003] The above problems lead to the complex operation and poor portability of the power supply circuit system of the transmission electron microscope in situ light-electric sample rod, which has caused great obstacles to its mass production and maintenance.

Method used

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  • A method of manufacturing a detachable light source substrate
  • A method of manufacturing a detachable light source substrate
  • A method of manufacturing a detachable light source substrate

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Embodiment Construction

[0025] The technical solutions and beneficial effects of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] The present invention provides a detachable light source substrate, which includes a metal welding seat and a sapphire blocking piece etched with a groove. First, the welding groove 2 is etched on the copper sheet 1, and the 0402 chip LED 3 is welded in the welding groove 2; then, etch the groove 6 and the screw hole 7 on the side of the sapphire blocking sheet 4 etched with the through hole 5, use tin foil to set the isolation area on the picture, and sputter gold ions in the exposed area 8 to form electrodes and wire; finally, insert the welding seat 10 with 0402 SMD LED into the groove, and fix it with screw 9.

[0027] The present invention also provides a method for manufacturing a detachable light source substrate, which is carried out according to the following steps:

[0028] 1) Cut the copper sheet wi...

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Abstract

The invention discloses a manufacturing method of a detachable light source substrate, which comprises the following steps: step 1, etching a welding groove on a copper sheet to obtain a metal welding seat; then welding both ends of a 0402 patch LED in the welding groove to obtain LED welding seat; step 2, etch grooves and screw holes on the side of the sapphire plug with through holes etched, wash and dry, then cool; step 3, wrap the sapphire plug with tin foil, and splash on the exposed area Inject gold ions to form electrodes and wires; step 4, insert the LED welding seat into the groove of the sapphire plug and fix it with screws. The manufacturing process of this manufacturing method is simple, and the manufactured light source substrate is small in volume, low in cost and good in transplantability.

Description

technical field [0001] The invention belongs to the technical field of an in-situ photo-electric sample rod in a transmission electron microscope, and particularly relates to the preparation of a detachable light source substrate of an in-situ photo-electric sample rod for a transmission electron microscope. Background technique [0002] The transmission electron microscope is a microscopic instrument that uses the scattered signals generated by the interaction of incident electrons with the nucleus and extranuclear electrons of the sample. Through the transmission electron microscope, high-resolution micrographs, electron diffraction patterns and electron energy loss spectra of the sample material can be obtained to characterize the microscopic morphology, crystal structure and chemical composition of the sample. Due to its superior performance such as high magnification and high resolution, it has been widely used in fields such as virology, material science, nanotechnolog...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48
CPCH01L33/483H01L2933/0033
Inventor 熊雨薇张泽童尹奎波孙立涛辛磊文一峰汤佳慧史旭龙张涵
Owner SOUTHEAST UNIV