A kind of high-strength high-modulus epoxy resin composition and its preparation method and application

A technology of epoxy resin and composition, which is applied in the field of thermosetting resins, can solve the problems of adverse effects of resin and composite materials on moisture and heat resistance, high cost, cumbersome preparation steps, etc., and achieves suitable for large-scale preparation, low cost, and wide source of raw materials Effect

Active Publication Date: 2022-02-01
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the special epoxy monomers or curing agents disclosed in Patent Documents 3 and 4 have potential problems such as cumbersome preparation steps and high cost on the one hand, and on the other hand, the polar groups in the molecular structure will also affect the moisture and heat resistance of resins and composite materials. performance is adversely affected

Method used

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  • A kind of high-strength high-modulus epoxy resin composition and its preparation method and application
  • A kind of high-strength high-modulus epoxy resin composition and its preparation method and application
  • A kind of high-strength high-modulus epoxy resin composition and its preparation method and application

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Effect test

preparation example Construction

[0062] (5) Preparation of epoxy resin composition

[0063] Add all the epoxy components into the stirring disperser and heat to 90°C to stir and mix evenly. After adding the thermoplastic resin modifier, continue to heat up to 135°C and stir to dissolve evenly. Then cool down to 70°C and add the curing agent. Material, obtains described epoxy resin composition.

[0064] (6) Preparation of prepreg

[0065] Use coating equipment to coat the epoxy resin composition prepared by above-mentioned (5) on the release paper, make a resin film, and then laminate the film on the carbon fiber (product model T800SC-24K, Japan Toray Co.) on both sides, heat and press with a hot roller at a temperature of 110° C. and 1 atmospheric pressure to fully impregnate the resin composition and carbon fibers (volume content 64%) to obtain a prepreg product.

[0066] (7) Performance testing of cured resin and composite materials

[0067] The bending performance of the cured resin is tested according ...

Embodiment 1

[0073] Add 100 parts by mass of m-phenylenediamine tetraglycidyl epoxy resin and 15 parts by mass of polyethersulfone into the stirring disperser, heat up to 135°C and stir to dissolve evenly, then cool down to 70°C and add 70 parts by mass of 3,3' - diaminodiphenyl sulfone, stirring and dispersing evenly before discharging to obtain an epoxy resin composition.

Embodiment 2

[0075] Add 100 parts by mass of m-phenylenediamine tetraglycidyl epoxy resin and 50 parts by mass of p-aminophenol triglycidyl epoxy resin into the stirring disperser and heat to 90°C to stir and mix evenly, then add 22.5 parts by mass of poly For ether sulfone, heat up to 135°C and stir to dissolve evenly, then cool down to 70°C and add 100 parts by mass of 3,3'-diaminodiphenylsulfone, stir and disperse evenly, then discharge to obtain an epoxy resin composition.

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Abstract

The invention discloses a high-strength and high-modulus epoxy resin composition as well as a preparation method and application thereof. The epoxy resin composition is prepared from the following components: m-phenylenediamine tetraglycidyl epoxy resin represented by formula I; a solid aromatic amine curing agent containing a meta-substituted structure; and a thermoplastic resin modifier. The epoxy main component m-phenylenediamine tetraglycidyl epoxy molecular structure in the epoxy resin composition of the present invention has low polar group content, so the cured product has the characteristics of low dilution rate; and m-phenylenediamine Tetraglycidyl epoxy has low room temperature viscosity and moderate curing activity, so that the epoxy resin composition has good processability. The present invention utilizes m-phenylenediamine tetraglycidyl epoxy resin as the main epoxy component and cured with meta-substituted aromatic amine curing agent to produce a cross-linked network with higher cross-linking density and tighter and regular molecular packing. The material also has higher modulus and strength.

Description

technical field [0001] The invention relates to a high-strength and high-modulus epoxy resin composition, a preparation method and application thereof, and belongs to the field of thermosetting resins. Background technique [0002] Carbon fiber reinforced resin matrix composites have been widely used as structural materials in various fields of the national economy such as aviation, aerospace, rail transit, and sporting goods due to their outstanding advantages such as high specific strength, high specific modulus, and fatigue resistance. In terms of material composition, carbon fiber reinforced resin matrix composites are a type of composite materials with resin polymer as the matrix and continuous carbon fiber as the reinforcement. Among them, epoxy resin has good mechanical properties, heat resistance, corrosion resistance and excellent It has become one of the most important and widely used resin matrices in the field of structural composite materials. Carbon fiber stru...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07D303/36C07D301/27C08G59/32C08G59/50C08G59/10C08G59/64C08L63/00C08L81/06C08L79/08C08K7/06C08J5/24C08J5/04
CPCC07D303/36C07D301/27C08G59/3218C08G59/504C08G59/64C08G59/10C08L63/00C08J5/24C08J5/042C08L2205/025C08L2205/03C08J2363/00C08J2481/06C08J2479/08C08J2463/00C08K7/06C08L81/06C08L79/08
Inventor 杨欣程兵赵晓娟左小彪祁志强于然张瑛黄伟
Owner INST OF CHEM CHINESE ACAD OF SCI
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