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An Enhanced Coupling Three-Dimensional Hairpin Filter Using TSV Technology

A filter and coupling technology, applied in the field of filters, can solve problems such as poor filtering performance

Active Publication Date: 2021-09-10
YOSHIHIRO COMM EQUIP GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an enhanced coupling three-dimensional hairpin filter using TSV technology, which realizes the coupling enhancement of the hairpin filter and solves the problem of poor filtering performance of the traditional hairpin filter planar structure

Method used

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  • An Enhanced Coupling Three-Dimensional Hairpin Filter Using TSV Technology
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  • An Enhanced Coupling Three-Dimensional Hairpin Filter Using TSV Technology

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Embodiment Construction

[0019] The present invention will be described in detail below in combination with specific embodiments.

[0020] An enhanced coupling three-dimensional hairpin filter using TSV technology, including RDL to make a filter coupling structure, and adopting TSV for signal transmission between two adjacent filter coupling structures.

[0021] The RDL-made filter coupling structure of each layer includes four resonant cavities, and each resonant cavity is in one-to-one correspondence with the resonant cavities of the adjacent RDL-made filter coupling structure.

[0022] Each resonant cavity includes three lines. The upper U-shaped structure of the resonant cavity represents the series connection of an inductor and a capacitor in the circuit, and the lower U-shaped structure represents the parallel connection of an inductor and a capacitor in the circuit.

[0023] Each line communicates with the three lines of the corresponding resonant cavity through the TSV.

[0024] Several TSVs ...

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Abstract

The invention discloses an enhanced coupling three-dimensional hairpin filter adopting TSV technology, which is characterized in that a filter coupling structure is made by RDL, and TSV is used for signal transmission between adjacent two filter coupling structures. The enhanced coupling three-dimensional hairpin filter adopting TSV technology of the present invention has a three-dimensional structure. The filter transmits two hairpin filters with the same planar RDL structure through TSV signals to enhance the coupling and obtain better filtering performance.

Description

technical field [0001] The invention belongs to the technical field of filters, and in particular relates to an enhanced coupling three-dimensional hairpin filter using TSV technology. [0002] technical background [0003] With the rapid development of science and technology in the 21st century, the microwave field technology in wireless transmission is more prominent. Microwaves in the 300MHz to 300GHz frequency band are widely used in military, aviation and other fields. In communication systems and radio frequency circuits, microwave filters are widely used, and their design and performance play a crucial role. A microwave filter is a classic frequency-selective device, which is small in size, simple to manufacture, and easy to design. With the development of science and technology, wireless products based on wireless communication are becoming more and more popular. Corresponding spectrum resources are getting tighter. In particular, the frequency bands used in daily...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/208
CPCH01P1/208
Inventor 王凤娟柯磊余宁梅
Owner YOSHIHIRO COMM EQUIP GRP CO LTD