Device and method for degumming silicon rods after cutting

Abstract

The invention discloses a degumming device and method for silicon rods after cutting. The device comprises: a cleaning unit and a degumming and slicing unit. The cleaning unit is provided with a spray assembly; A heating component and hot water are provided, and a bearing component is arranged above the degumming and slicing unit. The bearing component includes a push plate and a guard plate arranged at intervals. The push plate and the guard plate are arranged at both ends of the cut silicon rod along the length direction. The plate can move along the length direction of the cut silicon rod. The guard plate includes a connected guard part and a partition part. The guard part is provided with an opening that runs through the length direction of the cut silicon rod. The suction cup connected with the mechanical arm passes through the opening. In contact with the end of the cut silicon rod, the partition is set on the upper end of the side of the guard plate close to the push plate, and an accommodation gap is formed between the partition and the guard plate. The degumming and slicing unit further includes atomization spraying Assemblies, the atomizing spray assembly is arranged above the accommodating gap.

Description

technical field [0001] The invention belongs to the technical field of cutting and slicing silicon wafers, and in particular relates to a degumming device and method for silicon rods after cutting. Background technique [0002] In the related art, after the silicon wafer is cut, the cut silicon wafer needs to be cleaned and separated. The current degumming method after cutting is to soak the silicon wafer in hot water for about 20 minutes, and then manually separate and take the silicon wafer. In the existing degumming method, on the one hand, silicon powder or cutting mortar is likely to remain on the surface of the silicon wafer after degumming, which affects the progress of the subsequent process; The surface tension between the wafer and the silicon wafer is too strong, and it is easy to cause residual stress on the edge of the silicon wafer during the process of taking and dividing the wafer, resulting in chip (edge ​​chipping), and the labor efficiency is low, resultin...

AI Technical Summary

Problems solved by technology

In the existing degumming method, on the one hand, silicon powder or cutting mortar is likely to remain on the surface of the silicon wafer after degumming, which affects the progress of the subsequent process; The surface tension between the wafer and the silicon wafer is too strong, and it is easy to cause residual stress on the edge of the silicon wafer during the process of taking and dividing the wafer, resulting in chip (edge ​​chipping), and the labor efficiency is low, resulting in low yield and high cost.

[0003] Therefore, the existing degumming technology of silicon rod after cutting needs to be improved

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