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X-ray glue path measuring device and method

A measurement device and measurement method technology, applied in the field of radiation imaging, can solve the problems of long scanning time, high price, and difficulty in rapid detection, and achieve the effects of high sensitivity, accurate on-line detection of glue path imaging, and significant market application value

Active Publication Date: 2020-06-23
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional X-ray fluoroscopy imaging technology reduces the contrast of the image due to the overlapping of objects on the X-ray path. For the inspection of glue roads, the density of glue is generally lower than that of shells, plastic structural parts, circuit boards, Chips, etc., belong to the detection of weakly absorbing thin-layer objects in the strong absorbing background, and it is difficult to directly identify the glue path from the X-ray fluoroscopy image
Although X-ray CT imaging technology can realize three-dimensional imaging of electronic products through scanning at different angles, and can identify glue paths; but X-ray CT, especially the microfocus cone-beam CT imaging system used for electronic product inspection, is expensive, and the scanning It takes a long time, and it usually takes more than ten minutes to complete the scanning of an electronic product. It is difficult to realize online rapid detection on the production line.
Therefore, the existing technology is difficult to achieve fast, online and accurate measurement of the glue path of electronic products

Method used

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  • X-ray glue path measuring device and method

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Embodiment Construction

[0037] Embodiments of the present invention will be described below with reference to the accompanying drawings. Those skilled in the art would recognize that the described embodiments can be modified in various ways or combinations thereof without departing from the spirit and scope of the invention. Accordingly, the drawings and description are illustrative in nature and not intended to limit the scope of the claims. Also, in this specification, the drawings are not drawn to scale, and like reference numerals denote like parts.

[0038] figure 1 It is a schematic flow chart of the X-ray glue path measuring method of the present invention, as figure 1 As shown, the X-ray glue path measuring method of the present invention comprises the following steps:

[0039] Step S1, acquiring the first X-ray image of the glued object to be detected;

[0040] Step S2, comparing the first X-ray image of the object to be detected with glue and the second X-ray image of the object without...

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Abstract

The invention discloses an X-ray glue path measuring device and method, and the device comprises an image obtaining device which is used for obtaining a first X-ray image of a to-be-detected glue object; an image processing module used for comparing the first X-ray image with the second X-ray image of the glue-free object to obtain a third X-ray image of a glue path in the to-be-detected glue object; and a glue path measuring module used for measuring glue path information in the to-be-detected glued object according to the third X-ray image. According to the invention, high-sensitivity, rapidand accurate glue path imaging on-line detection can be realized, and the method can be used for on-line real-time rapid detection of an electronic product production line and is suitable for glue path detection of all electronic products.

Description

technical field [0001] The invention relates to the technical field of radiation imaging, in particular to an X-ray glue path measuring device and method. Background technique [0002] At present, adhesive bonding technology represented by dispensing technology is widely used in a series of electronic products such as notebook computers, tablet computers, and mobile phones, such as glass screens and casings, display screens and casings, metal casings and internal plastic structural parts Equally using adhesive bonding technology. Dispensing technology generally uses a dispensing machine to place the components of electronic products to be bonded, such as casings, etc., on the work surface or special fixtures, and edit the position and glue volume of the dispensing needle according to its own bonding process requirements Size and interval operation time and other working parameters, and then perform automatic dispensing operations; due to the editable characteristics of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B15/00G01B15/02G01N23/04
CPCG01B15/00G01B15/02G01N23/04
Inventor 李亮陈志强张丽
Owner TSINGHUA UNIV