Superconducting conductor high-precision hole shrinkage method and device

Abstract

The invention discloses a superconducting conductor high-precision hole shrinkage method and a superconducting conductor high-precision hole shrinkage device. The method comprises that: a plurality ofpairs of forming die grooves are sequentially formed in one or more pairs of rollers in a scaled-down or enlarged mode, and the multiple pairs of forming die grooves in the one or more pairs of rollers are used for conducting successive rolling extrusion compression forming on the superconducting conductor according to the needed total hole shrinkage amount and the hole shrinkage amount of each time. The device of the invention comprises the pair of rollers which are respectively arranged on a support, a plurality of die grooves which are symmetrical and corresponding to each other are respectively distributed on the peripheral wall surfaces of the pair of rollers, and the corresponding cross section sizes, radiuses or corresponding diameters of the plurality of die grooves on the rollersare respectively reduced or enlarged in proportion. The superconducting conductor high-precision reducing method is simple, high in precision and easy to implement; and the device is simple and reasonable in structure, stable in operation and high in precision.

Description

technical field [0001] The invention relates to a method and a device for reducing the diameter of a superconducting conductor with high precision. Background technique [0002] The existing diameter reduction processing of superconducting conductors usually uses plane unidirectional compression diameter reduction forming, and also uses sequential multi-stage continuous compression diameter forming. Facts have proved that no matter what kind of existing device is used, and in what way the diameter is reduced, there is a common defect, that is, the problem of precision. For the front, it goes without saying that not only the accuracy cannot meet the requirements, but also the processing and manufacturing efficiency is relatively low, so it is rarely used. As for the latter device and its pressing method, also due to the unreasonableness of the structure of the forming device and its pressing method, the precision of its diameter-reducing forming is difficult to meet the high...

AI Technical Summary

Problems solved by technology

For the front, it goes without saying that not only the accuracy cannot meet the requirements, but also the processing efficiency is relatively low, so it is rarely used

As for the latter device and its pressing method, also due to the unreasonableness of the structure of the forming device and its pressing method, the precision of its diameter-reducing forming is difficult to meet the high requirements, and the installation process is complicated, especially The consistency requirements for the installation accuracy of the pressing and reducing devices at all levels are particularly high. The existing installation technology methods are difficult to meet the accuracy requirements of product production, and the requirements for the processing site are also relatively high.

For example, there must be some differences in the installation of each set of shrinking rollers. When the conductor is processed by multi-stage pressing, different degrees of deformation will occur at different parts of the conductor, so there is a certain degree of randomness and variability in the processing and forming errors. Determinism; and multi-stage continuous pressing will produce inconsistent thermal effect deformation differences on the conductor, and will also cause random deformation and precision errors of a superconducting conductor after multi-stage pressing.

In particular, in the existing way of compressing the diameter, a pair of roller molds are arranged in a fully butt-closed manner with each other, and flash deformation may also occur

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