A semiconductor laser cos alloy strength detection device and detection method

A technology for alloy strength and detection devices, which is applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve the problems that the strength of COS removal is not easy to control, the mold strips cannot be fixed accurately, and the result error is large. It is not easy to solve the problem Control, operation and inspection are convenient, reliable and cost-effective

Active Publication Date: 2022-07-12
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The detection method has simple tools, but inconvenient operation and low efficiency
There is no guarantee that the position of COS removal on all the tube bases of the entire mold bar is consistent, and the strength of COS removal is not easy to control
The position of the mold strip cannot be fixed accurately during observation, which makes the error of the detected result larger

Method used

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  • A semiconductor laser cos alloy strength detection device and detection method
  • A semiconductor laser cos alloy strength detection device and detection method
  • A semiconductor laser cos alloy strength detection device and detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The translation mechanism can be the following structure, which includes a sliding rod 18 horizontally arranged on the base 1 along the front-rear direction, a sliding seat II 19 slidably installed on the sliding rod 18, and a dovetail guide rail horizontally arranged on the sliding seat II 19 along the left-right direction. 20 and the sliding seat I 11 slidably installed on the dovetail guide rail 20, and the fixing bar 21 is arranged on the sliding seat I 11. The sliding seat II 19 slides along the front and rear directions of the sliding rod 18 to realize the adjustment of the position of the die bar 31 in the front and rear directions.

Embodiment 2

[0046] The height adjustment mechanism can be the following structure, which includes a guide rod II 8 vertically arranged on the base 1, a sliding sleeve 9 slidably installed on the guide rod II 8, and a sliding sleeve 9 that is screwed on the sliding sleeve 9 for relatively the sliding sleeve 9. The guide rod II 8 locks the fixed handle screw II 15, and the support 10 is connected with the sliding sleeve 9. After loosening the handle screw II 15, the support 10 can slide up and down along the guide rod II 8 through the sliding sleeve 9. After the height of the pressing needle 24 is adjusted in place, the position of the sliding sleeve 9 can be fixed by tightening the handle screw II 15. Fixing of the height position of the support 10.

Embodiment 3

[0048] It may also include a positioning hole provided at the lower end of the mold bar 31 and a positioning protrusion 26 provided on the fixing bar 21 that matches the positioning hole. The positioning protrusion 26 is inserted into the positioning hole at the lower end of the mold bar 31 . The positioning protrusion 26 can improve the positioning accuracy of the mold bar 31 when it is mounted on the fixing bar 21 .

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PUM

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Abstract

A semiconductor laser COS alloy strength detection device and detection method, the lower end of the indenter can be seen through the eyepiece of the microscope, the position where the COS needs to be peeled off can be accurately found during observation, and the accuracy of the detection result is improved. The position of the fixing bar can be adjusted by the translation mechanism, so that the laser tube seat on the die bar that needs to remove COS is located just below the pressing needle. Use the indenter drive mechanism to drive the indenter down to complete the peeling of the COS on all the laser tube bases on the die strip. After the COS is stripped off, observe whether the silver glue residue on the tube base is void and uniform, so that the alloy can be accurately judged. Whether the strength meets the requirements. The whole device is simple in structure, low in cost, convenient and reliable in operation and inspection, and solves the problem that the force is not easy to control during manual COS rejection. At the same time, in the process of COS rejection, the operator does not directly contact the product, thus avoiding the human factor causing the product pollution problem.

Description

technical field [0001] The invention relates to the technical field of semiconductor laser packaging, in particular to a semiconductor laser COS alloy strength detection device and a detection method. Background technique [0002] Due to the advantages of small size, light weight, high electro-optical conversion efficiency, long life and high reliability, semiconductor lasers have gradually replaced the use of gas and solid-state lasers in the fields of communication, medical treatment, display, industrial production and security. is also gradually expanding. The working principle of a semiconductor laser is: through a certain excitation method, a non-equilibrium is realized between the energy band (conduction band and valence band) of the semiconductor substance, or between the energy band of the semiconductor substance and the energy level of the impurity (acceptor or donor) Stimulated emission occurs when a large number of electrons in the state of population inversion r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 张广明汤庆敏赵克宁秦莉贾旭涛
Owner Shandong Huaguang Optoelectronics Co. Ltd.
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