Mini LED mainboard manufacturing method

Abstract

The invention provides a mini LED mainboard manufacturing method. The mini LED mainboard manufacturing method comprises the following steps: S1, preparing a double-sided copper-clad plate; S2, performing drilling; S3, performing copper plating; S4, filling a hole; S5, manufacturing a circuit; S6, performing solder masking of characters; S7, preparing a metal layer: forming the metal layer on the LED surface of the double-sided copper-clad plate in a physical vapor deposition manner; S8, performing photoetching; S9, carrying out surface treatment, molding and testing. According to the PCB, theultra-thin metal layer is deposited on the LED surface of the mainboard through physical vapor deposition (PVD), then a fine circuit is manufactured through a photoetching process, the limit capacityis about 20 / 20 microns, the line width and the line distance are achieved, and the LED lamp pitch is made to range from 0.1 mm to 0.4 mm. According to the invention, the current production capacity ofthe mini LED display screen is broken through, and higher definition is achieved.

Description

technical field [0001] The invention belongs to the field of PCB processing methods, and in particular relates to a method for manufacturing a mini LED main board. Background technique [0002] mini LED is a "small LED lamp bead"-this is small, which is smaller than ordinary LED bulbs. But please note that each of its light-emitting units (or each "bulb") is still not small enough to be used as a screen pixel, so when we say "mini LED screen", this is actually a wrong expression , because mini LED itself cannot be used as a screen panel, its real use is actually a backlight module for LCD screens. [0003] Compared with the traditional side backlight or the old-fashioned direct-lit backlight, the advantages and disadvantages of mini LED are very obvious. The first advantage is that because each backlight "bulb" is smaller, it can achieve a more sophisticated dynamic backlight effect. While effectively improving the brightness and contrast of the screen, it can also suppr...

AI Technical Summary

Problems solved by technology

The disadvantages are mainly the high energy consumption, high heat generation, high cost caused by the high-density LED backlight module, and the problem of the thickness of the whole screen caused by the liquid crystal display.

[0004] At present, the mainstream mini LED motherboards all adopt conventional PCB processing technology, but it is difficult for the LED motherboard PCB of the existing technology to achieve a lamp pitch of less than 0.6mm