Mini LED mainboard manufacturing method

A manufacturing method and motherboard technology, applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as high energy consumption, thick screen, high heat generation, etc., and achieve high-definition effects

Pending Publication Date: 2020-06-26
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages are mainly the high energy consumption, high heat generation, high cost caused by the high-density LED backlight module, and the problem of the thickness of the whole screen caused by the liquid crystal displ

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] Example 1

[0029] A method for manufacturing a mini LED motherboard, which is characterized by including the following steps:

[0030] S1. Prepare a double-sided copper clad laminate, pass the circuit board through the inner layer, pressing, and laser processes to prepare a double-sided copper clad laminate;

[0031] S2. Drilling: drilling the double-sided copper clad laminate to ensure that the drilled hole penetrates the two layers of copper foil of the double-sided copper clad laminate;

[0032] S3. Copper plating: copper plating is performed on the wall of the drilled hole of the double-sided copper clad laminate, so that the copper plating layer on the wall of the drilled hole connects the copper foils on both sides of the double-sided copper clad laminate, so that the The copper foils on both sides of the double-sided copper clad laminate form electrical connections;

[0033] S4. Filling holes: filling the holes with black resin or black ink;

[0034] S5. Circuit productio...

Example Embodiment

[0046] Example 2

[0047] A method for manufacturing a mini LED motherboard, which is characterized by including the following steps:

[0048] S1. Prepare a double-sided copper clad laminate, pass the circuit board through the inner layer, pressing, and laser processes to prepare a double-sided copper clad laminate;

[0049] S2. Drilling: drilling the double-sided copper clad laminate to ensure that the drilled hole penetrates the two layers of copper foil of the double-sided copper clad laminate;

[0050] S3. Copper plating: copper plating is performed on the wall of the drilled hole of the double-sided copper clad laminate, so that the copper plating layer on the wall of the drilled hole connects the copper foils on both sides of the double-sided copper clad laminate, so that the The copper foils on both sides of the double-sided copper clad laminate form electrical connections;

[0051] S4. Filling holes: filling the holes with black resin or black ink;

[0052] S5. Circuit productio...

Example Embodiment

[0064] Example 3

[0065] A method for manufacturing a mini LED motherboard, which is characterized by including the following steps:

[0066] S1. Prepare a double-sided copper clad laminate, pass the circuit board through the inner layer, pressing, and laser processes to prepare a double-sided copper clad laminate;

[0067] S2. Drilling: drilling the double-sided copper clad laminate to ensure that the drilled hole penetrates the two layers of copper foil of the double-sided copper clad laminate;

[0068] S3. Copper plating: copper plating is performed on the wall of the drilled hole of the double-sided copper clad laminate, so that the copper plating layer on the wall of the drilled hole connects the copper foils on both sides of the double-sided copper clad laminate, so that the The copper foils on both sides of the double-sided copper clad laminate form electrical connections;

[0069] S4. Filling holes: filling the holes with black resin or black ink;

[0070] S5. Circuit productio...

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Abstract

The invention provides a mini LED mainboard manufacturing method. The mini LED mainboard manufacturing method comprises the following steps: S1, preparing a double-sided copper-clad plate; S2, performing drilling; S3, performing copper plating; S4, filling a hole; S5, manufacturing a circuit; S6, performing solder masking of characters; S7, preparing a metal layer: forming the metal layer on the LED surface of the double-sided copper-clad plate in a physical vapor deposition manner; S8, performing photoetching; S9, carrying out surface treatment, molding and testing. According to the PCB, theultra-thin metal layer is deposited on the LED surface of the mainboard through physical vapor deposition (PVD), then a fine circuit is manufactured through a photoetching process, the limit capacityis about 20/20 microns, the line width and the line distance are achieved, and the LED lamp pitch is made to range from 0.1 mm to 0.4 mm. According to the invention, the current production capacity ofthe mini LED display screen is broken through, and higher definition is achieved.

Description

technical field [0001] The invention belongs to the field of PCB processing methods, and in particular relates to a method for manufacturing a mini LED main board. Background technique [0002] mini LED is a "small LED lamp bead"-this is small, which is smaller than ordinary LED bulbs. But please note that each of its light-emitting units (or each "bulb") is still not small enough to be used as a screen pixel, so when we say "mini LED screen", this is actually a wrong expression , because mini LED itself cannot be used as a screen panel, its real use is actually a backlight module for LCD screens. [0003] Compared with the traditional side backlight or the old-fashioned direct-lit backlight, the advantages and disadvantages of mini LED are very obvious. The first advantage is that because each backlight "bulb" is smaller, it can achieve a more sophisticated dynamic backlight effect. While effectively improving the brightness and contrast of the screen, it can also suppr...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62
CPCH01L25/0753H01L33/483H01L33/62H01L2933/0066
Inventor 李清春胡玉春叶汉雄闫棕楷
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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