Inward-contracting type heat dissipation device
A heat-dissipating device and retractable technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of reducing heat dissipation capacity, affecting heat dissipation effect, and tightly fitting CPU, so as to increase the heat dissipation area, improve the heat dissipation effect, Avoid accidental scratches
Active Publication Date: 2020-07-03
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Problems solved by technology
[0003] However, in actual application, the heat dissipation paste applied on the bottom of the existing heat sink is easily scratched during installation and transportation, resulting in uneven application of heat dissipation paste and inability to fit closely with the CPU, reducing heat dissipation capacity and affecting heat dissipation effect
[0004] In addition, since the heat sink needs to be attached to the CPU during the installation process of the existing heat sink, and then the pressing operation is performed, the extrusion effect will also cause the heat dissipation paste to overflow, resulting in adhesion with peripheral devices and causing electrical conduction or other problems. bad
Method used
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Embodiment Construction
[0048] For the convenience of description, the coordinate system is defined as figure 1 shown.
[0049] Such as figure 1 As shown, a retractable heat sink includes a mounting frame 1 and a heat sink 2 disposed in the mounting frame 1 .
[0050] Such as Figure 13 As shown, the mounting frame 1 includes a square outer frame formed by connecting the front side plate 111, the left side plate 113, the rear side plate 112 and the right side plate 114 in sequence, and the heat sink 2 is arranged on within the stated frame. At least two outer ear plates 12 are arranged on the outer surface of the outer frame, and the lower side of the outer ear plates 12 is flush with the lower end surface of the outer frame.
[0051] Preferably, two outer ear plates 12 are arranged on the outer surface of the outer frame, and the two outer ear plates 12 are arranged diagonally. As a specific implementation manner, in this embodiment, the two outer ear plates 12 are respectively arranged on the ...
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The invention discloses an internal contracting type heat dissipation device, and relates to the technical field of computer hardware equipment. The device comprises a mounting frame, which comprisesan outer frame, wherein a cooling fin is arranged in the outer frame, and comprises a plate body, fins and bosses are arranged on the upper side face and the lower side face of the plate body respectively, the lower side surface of the boss is coated with heat dissipation paste, the left side and the right side of the outer frame are respectively provided with an inner lug plate which is bent towards the inner side, a pressing rod is fixedly arranged on the plate body, the pressing rod penetrates through the inner lug plates and extends to the position above the inner lug plates, the pressingrod is sleeved with a spring which is used for preventing the plate body from moving downwards, elastic clamping plates are arranged on the front side and the rear side of the plate body respectively,first positioning projections are arranged on the elastic clamping plates, and second positioning projections matched with the first positioning projections are arranged on the outer frame. Accordingto the device, mistaken scratching in the installation and transportation process can be effectively avoided while the problem that heat dissipation paste overflows can be effectively avoided.
Description
technical field [0001] The invention relates to the technical field of computer hardware equipment, in particular to a retractable heat dissipation device that can prevent heat dissipation paste from being accidentally scratched. Background technique [0002] With the popularization of electronic products and the development of various data clouds, the application range of servers and personal computers is becoming wider and wider. As we all know, the CPU is the core of the server. With the increase of CPU integration and operating frequency, the power consumption increases accordingly, causing the CPU to generate a lot of heat, which brings about heat dissipation problems, and the requirements for heat sinks will also increase. [0003] However, in actual application, the heat dissipation paste applied on the bottom of the existing heat sink is easily scratched during installation and transportation, resulting in uneven application of heat dissipation paste and inability to...
Claims
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IPC IPC(8): H01L23/367H01L23/40
CPCH01L23/367H01L23/3672H01L23/40H01L2023/4087
Inventor 马亚辉于浩
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD